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Extracted text from sony hcd dc 1 owners manual (Ocr-read)
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HCD-DC1
TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 3
2. GENERAL
Parts Identification .......................................................... 4
Setting the Time .............................................................. 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Upper Cover Sub Assy .................................................... 7
3-3. CD Lid ............................................................................. 7
3-4. Front Panel Section ......................................................... 8
3-5. Tape Mechanism Deck .................................................... 8
3-6. CD Mechanism Deck (CDM55F-K6BD41A) ................ 9
3-7. Base Unit (BU-K6BD41A) ............................................. 9
3-8. Loading Motor Board ..................................................... 10
3-9. Cam (CDM55) ................................................................ 10
4. TEST MODE .............................................................. 11
5. ELECTRICAL ADJUSTMENTS
Deck Section ................................................................... 12
CD Section ...................................................................... 13
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - ....................... 15
6-2. Block Diagram - MAIN Section - ................................ 16
6-3. Block Diagram
- DISPLAY/POWER SUPPLY Section - ...................... 17
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 18
6-5. Printed Wiring Board - CD Board - ............................. 20
6-6. Schematic Diagram - CD Board - ................................ 21
6-7. Printed Wiring Board - TC Board - .............................. 22
6-8. Schematic Diagram - TC Board - ................................. 23
6-9. Schematic Diagram - MAIN Board (1/3) - ................. 24
6-10. Schematic Diagram - MAIN (2/3)/
LOADING MOTOR/HEADPHONE Boards - ............. 25
6-11. Schematic Diagram - MAIN (3/3)/LCD Boards - ...... 26
6-12. Printed Wiring Boards - MAIN/LCD/
LOADING MOTOR/HEADPHONE Boards - .............. 27
6-13. Printed Wiring Boards
- SWITCH/I/O SWITCH Boards - ................................ 28
6-14. Schematic Diagram
- SWITCH/I/O SWITCH Boards - ................................ 29
6-15. Printed Wiring Board - POWER Board - ...................... 30
6-16. Schematic Diagram - POWER Board - ......................... 31
6-17. IC Pin Function Description ........................................... 32
7. EXPLODED VIEWS
7-1. Upper Cover, Tape Mech Deck Section ......................... 37
7-2. Front Panel Section ......................................................... 38
7-3. Chassis Section ............................................................... 39
7-4. CD Mechanism Deck (CDM55F-K6BD41A) ................ 40
7-5. Base Unit (BU-K6BD41A) ............................................. 41
8. ELECTRICAL PARTS LIST ............................... 42CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
CAUTION : INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL : USYNLIG LASERSTRĂ LING VED Ă BNING NĂ R
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGĂ UDSAETTELSE
FOR STRĂ LING.
VORSICHT : UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEĂFFNET UND SICHEREITSVERRIEGELUNG
ĂBERBRĂCKT. NICHT DEM STRAHL AUSSETZEN.
VA R O!: AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NĂKYMĂTTĂMĂLLE LASERSĂTEILYLLE. ĂLĂ KATSO SĂTEESEEN.
VARNING : OSYNLING LASERSTRĂ LING NĂR DENNA DEL ĂR ĂPPNAD
OCH SPĂRREN ĂR URKOPPLAD. BETRAKTA EJ STRĂ LEN.
ADVERSEL : USYNLIG LASERSTRĂ LING NĂ R DEKSEL Ă PNES OG
SIKKERHEDSLĂ S BRYTES. UNNGĂ EKSPONERING FOR STRĂ LEN.
VIGYAZAT!: A BURKOLAT NYITĂSAKOR LĂTHATATLAN LĂZERSU-
GĂRVESZĂLY! KERĂLJE A BESUGĂRZĂST!
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 ËC dur-
ing repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.