Sony hcd cp x11 v1 1

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2 HCD-CPX11 Notes on chip component replacement- Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Par t No. MODEL IDENTIFICATION -“ Back Panel -“ Model Name Part No. AEP and UK models 4-252-358-0 [] Korean model 4-252-358-2 [] A ustralian model 4-252-358-3 []

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3 HCD-CPX11 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 9 3. DISASSEMBLY 3-1. Cover ........................................................................\ ....... 12 3-2. Front Panel Section ......................................................... 12 3-3. TC Board, Mechanical Deck .......................................... 13 3-4. PANEL Board .................................................................. 13 3-5. MAIN Board, PRE AMP Board ...................................... 14 3-6. CD Mechanism Deck (CDM80BH-F1BD81) ................. 14 3-7. Chassis (Top) ................................................................... 15 3-8. Lever (Loading R/L) ........................................................ 16 3-9. Disc Stop Lever, Disc Sensor Lever ................................ 17 3-10. DRIVER Board ............................................................... 17 3-11. BD81A Board .................................................................. 18 3-12. BU Section ...................................................................... 18 3-13. Optical Pick-up (KSM-215DCP) .................................... 19 3-14. Lever (BU Lock) ............................................................. 19 3-15. Close Lever ...................................................................... 20 3-16. Dir Lever, Gear (IDL-B) .................................................. 20 3-17. Gear (IDL-C) ................................................................... 21 4. TEST MODE ............................................................... 22 5. ELECTRICAL ADJUSTMENTS Deck Section .................................................................... 24 CD Section ...................................................................... 25 6. DIAGRAMS 6-1. Block Diagram -“ BD/DRIVER Section -“ ...................... 28 -“ TUNER/TAPE DECK Section -“ .................................. 29 -“ MAIN Section -“ ........................................................... 30 -“ DISPLAY/POWER SUPPLY Section -“ ....................... 31 6-2. Printed Wiring Board -“ BD81A Section -“ ..................... 32 6-3. Schematic Diagram -“ BD81A Section -“ ........................ 33 6-4. Printed Wiring Board -“ TC Section -“ ............................. 34 6-5. Schematic Diagram -“ TC Section -“ ............................... 35 6-6. Printed Wiring Board -“ MAIN Section -“ ....................... 36 6-7. Schematic Diagram -“ MAIN Section -“ .......................... 37 6-8. Printed Wiring Board -“ PRE AMP Section -“ .................. 38 6-9. Schematic Diagram -“ PRE AMP Section -“ .................... 39 6-10. Printed Wiring Board -“ LCD/DRIVER Section -“ ........... 40 6-11. Schematic Diagram -“ LCD/DRIVER Section -“ ............. 41 6-12. Printed Wiring Board -“ PANEL Section -“ ..................... 42 6-13. Schematic Diagram -“ PANEL Section -“ ........................ 43 6-14. Printed Wiring Board -“ S-MASTER Section -“ .............. 44 6-15. Schematic Diagram -“ S-MASTER Section -“ ................. 45 6-16. IC Pin Function Description ............................................ 51 7. EXPLODED VIEWS 7-1. MAIN Section ................................................................. 57 7-2. Front Panel Section ......................................................... 58 7-3. Lid (TC) Section .............................................................. 59 7-4. Chassis Section ................................................................ 60 7-5. S-MASTER AMP Section ............................................... 61 7-6. CD Mechanism Deck Section-1 (CDM80BH-F1BD81) ..................................................... 62 7-7. CD Mechanism Deck Section-2 (CDM80BH-F1BD81) ..................................................... 63 7-8. CD Mechanism Deck Section-3 (CDM80BH-F1BD81) ..................................................... 64 7-9. Base Unit Section (BU-F1BD81A) ................................. 65 8. ELECTRICAL PARTS LIST .................................. 66