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ATTENTION AU COMPOSANT AYANT RAPPORT
Ë LA SƒCURITƒ!!
LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR
LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES
PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIéCES SONY DONT LES NUMƒROS
SONT DONNƒS DANS CE MANUEL OU DANS LES
SUPPLƒMENTS PUBLIƒS PAR SONY.
To Exposed Metal
Parts on Set
0.15µF1.5k
W AC
voltmeter
(0.75V)
Earth Ground
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturersÕ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The ÒlimitÓ indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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Ñ 3 ÑTABLE OF CONTENTS
1. GENERAL
.......................................................................... 4
2. DISASSEMBLY
2-1. CD Door ............................................................................... 5
2-2. CD Mechanism Deck ............................................................ 5
2-3. Front Panel and Main Board ................................................. 6
2-4. Main Board and Tuner Board ............................................... 6
2-5. CD Tray ................................................................................ 7
2-6. CD Decoder Board ................................................................ 7
2-7. Base Unit .............................................................................. 8
3. MECHANICAL ADJUSTMENTS ................................ 9
4. ELECTRICAL ADJUSTMENTS ................................. 9
5. DIAGRAMS
5-1. Circuit Boards Location ...................................................... 14
5-2. Block Diagrams
¥ Tuner Section
(US, CND, E, SP, MY, MX, AUS models) ...................... 15
¥ Tuner Section (AEP, UK models) .................................... 17
¥ CD Section ....................................................................... 19
¥ Deck Section .................................................................... 21
¥ Main Section
(US, CND, E, SP, MY, MX, AUS models) ...................... 23
¥ Main Section (AEP, UK models) ..................................... 25
¥ Power Section
(US, CND, E, SP, MY, MX, AUS models) ...................... 27
¥ Power Section (AEP, UK models) ................................... 28
5-3. IC Block Diagrams .............................................................. 29
5-4. Printed Wiring Board ÑMain Section Ñ
(US, CND, E, SP, MY, MX, AUS models) ......................... 34
5-5. Schematic Diagram Ñ Main Section Ñ
(US, CND, E, SP, MY, MX, AUS models) ......................... 39
5-6. Schematic Diagram Ñ Main Section Ñ
(AEP, UK models) .............................................................. 43
5-7. Printed Wiring Board ÑMain Section Ñ
(AEP, UK models) .............................................................. 47
5-8. Printed Wiring Board Ñ CD Section Ñ ............................. 52
5-9. Schematic Diagram Ñ CD Section Ñ ............................... 57
5-10. Schematic Diagram Ñ Panel Section Ñ ......................... 61
5-11. Printed Wiring Board Ñ Panel Section Ñ ....................... 65
5-12. Printed Wiring Board Ñ Tuner Section Ñ
(US, CND, E, SP, MY, MX, AUS models) ....................... 71
5-13. Schematic Diagram Ñ Tuner Section Ñ
(US, CND, E, SP, MY, MX, AUS models) ....................... 75
5-14. Schematic Diagram Ñ Tuner Section Ñ
(AEP, UK models) ............................................................ 79
5-15. Printed Wiring Board Ñ Tuner Section Ñ
(AEP, UK models) ............................................................ 83
5-16. IC Pin Function ................................................................ 87
6. EXPLODED VIEWS
6-1. Top and Bottom Cabinet Section ........................................ 89
6-2. Front Panel Section ............................................................. 90
6-3. Cassette Mechanism Deck Section 1 .................................. 91
6-4. Cassette Mechanism Deck Section 2 .................................. 92
6-5. CD Mechanism Deck Section 1 .......................................... 93
6-6. CD Mechanism Deck Section 2 .......................................... 94
6-7. Base Unit Section (KSM-213BCM) ................................... 95
7. ELECTRICAL PARTS LIST ........................................ 96
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
Ñ AC POWER SUPPLY CODE Ñ
AEP model
(Without voltage selector)
Singapore, Malaysia model
(With voltage selector)
UK model
US, Canadian model
Australian model
NOTE:
For detailed German, East European, CIS
model, refer to AEP model.
E, Mexican model
¥ Abbreviation
CND : Canadian model
MX : Mexican model
SP : Singapore model
MY : Malaysia model
AUS : Australian model
