Sony hcd bx 70dbi service manual

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HCD-BX70DBi 2 1. SERVICING NOTES ............................................. 3 2. GENERAL .................................................................. 4 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Panel (Side L/R) .............................................................. 7 3-3. Top Panel Block .............................................................. 7 3-4. TOP KEY Board, IP Board, Panel Top (IP) .................... 8 3-5. Front Panel Block ........................................................... 8 3-6. Rear Panel Block ............................................................ 9 3-7. Panel (Rear) .................................................................... 9 3-8. AMP Board Block ........................................................... 10 3-9. POWER Board Block ..................................................... 10 3-10. MAIN Board ................................................................... 11 3-11. DAB Board, Module (DAB Tuner) ................................ 11 3-12. Loading Mechanism Block ............................................. 12 3-13. Base Unit ........................................................................\ . 12 3-14. Belt ........................................................................\ .......... 13 3-15. OP Base Assy (KSM-213D) ........................................... 13 4. TEST MODE ............................................................ 14 5. ELECTRICAL CHECKS ...................................... 16 6. DIAGRAMS 6-1. Block Diagram - CD SERVO Section - .......................... 17 6-2. Block Diagram - iPod, TUNER, DAB Section - ............ 18 6-3. Block Diagram - MAIN Section - ................................... 19 6-4. Block Diagram - PANEL, POWER SUPPLY Section - ........................... 20 6-5. Printed Wiring Boards - CD Section - ............................ 22 6-6. Schematic Diagram - CD Board - ................................... 23 6-7. Printed Wiring Board - DAB Board - ............................. 24 6-8. Schematic Diagram - DAB Board - ................................ 25 6-9. Printed Wiring Board - IP Board - .................................. 26 6-10. Schematic Diagram - IP Board - ..................................... 27 6-11. Printed Wiring Boards - MAIN Section - ....................... 28 6-12. Schematic Diagram - MAIN Section (1/3) - ................... 29 6-13. Schematic Diagram - MAIN Section (2/3) - ................... 30 6-14. Schematic Diagram - MAIN Section (3/3) - ................... 31 6-15. Printed Wiring Boards - AMP/HEADPHONE Section - ..................................... 32 6-16. Schematic Diagram - AMP/HEADPHONE Section - .... 33 6-17. Printed Wiring Boards - PANEL Section - ..................... 34 6-18. Schematic Diagram - PANEL Section - .......................... 35 6-19. Printed Wiring Board - POWER Board - ........................ 36 6-20. Schematic Diagram - POWER Board - .......................... 37 7. EXPLODED VIEWS 7-1. Panel Sectiom ................................................................. 45 7-2. Top Panel Section ........................................................... 46 7-3. Front Panel Section ......................................................... 47 7-4. MAIN Board Section ...................................................... 48 7-5. POWER Board Section ................................................... 49 7-6. Loading Mechanism Section .......................................... 50 7-7. Base Unit Section (BU-K6BD90-WOD) ........................ 51 8. ELECTRICAL PARTS LIST .............................. 52 TABLE OF CONTENTS NOTES ON CHIP COMPONENT REPLACEMENT - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. FLEXIBLE CIRCUIT BOARD REPAIRING - Keep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. iPod sectionCompatible iPod models: iPod touch iPod nano 3rd generation(video) iPod classic iPod nano 2nd generation (aluminum) iPod 5th generation (video) iPod nano 1stgeneration iPod 4th generation (color display) iPod 4th generation iPod mini GeneralPower requirements: 230 V AC, 50/60 Hz Power consumption: 63 watts Dimensions (w/h/d) (excl. speakers): Approx. 215 × 140 × 298 mm Mass (excl. speakers): Design and specifications are subject to change without notice. Approx. 3.9 kg CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radia- tion exposure. This appliance is classifi ed as a CLASS 1 LASER product. This marking is located on the rear or bottom exterior.

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HCD-BX70DBi 3 UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. ANTITHEFT UNLOCK MODE Procedure: 1. Press the [ ?/1 ] button to turn the power on. 2. Press the [FUNCTION] button to select CD. 3. Press two buttons of [ x/ CANCEL ] and [ A] for 5 seconds. 4. The message UNLOCKED is displayed on the fl uorescent indicator tube and the disc tray is unlocked. Note: When LOCKED is displayed, the tray lock is not released by turning power on/off with the [ ?/ 1 ] button. HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF Note: Please insert a screwdriver after removing the panel (side L). About disassembly of the panel (side L), please refer to 3-2. Pane\ l (Side L/R) (page 7).  Open the tray.  Push the boss.  Insert the driver.