Sony hcd az 1 d service manual

Page 1

2 HCD-AZ1D CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Laser component in this product is capable of emitting radiation e xceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. General Po wer req uirements 110 -“ 120 V, 220 -“ 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption 120 watts Dimensions (w/h/d) (excl. speakers) Approx. 190 × 300 × 335 mm Mass (excl. speakers) Approx. 6.1 kg Design and specifications are subject to change without notice.

Page 2

3 HCD-AZ1D TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 7 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 10 3-2. Top Cover, DC Fan .......................................................... 11 3-3. AMP Board, AV Board, Tuner (FM/AM) ....................... 11 3-4. MPEG Board ................................................................... 12 3-5. MPEG Holder .................................................................. 12 3-6. DVD Panel Tray .............................................................. 13 3-7. DVD Loader (WXD) ....................................................... 13 3-8. Optical Pick-up DM3451-A (SF-HD65F) ....................... 14 3-9. Front Panel Section ......................................................... 14 3-10. Cassette Mechanism Deck (CMAL5Z220C) .................. 15 3-11. KEY Board ...................................................................... 15 3-12. HP Board, MIC CONTROL Board ................................. 16 3-13. MAIN Board .................................................................... 16 3-14. POWER Board ................................................................ 17 3-15. Panel Cass ........................................................................\ 17 4. TEST MODE ............................................................... 18 5. MECHANICAL ADJUSTMENTS ......................... 19 6. ELECTRICAL ADJUSTMENTS .......................... 19 7. DIAGRAMS 7-1. Block Diagram - MPEG-1 Section - ......................... 22 7-2. Block Diagram - MPEG-2 Section - ......................... 23 7-3. Block Diagram - USB Section - ................................ 24 7-4. Block Diagram - AUDIO Section - ........................... 25 7-5. Block Diagram - PANEL/POWER Section - ............ 26 7-6. Printed Wiring Board - MAIN Section - ................... 27 7-7. Schematic Diagram - MAIN Section (1/4) - ............. 28 7-8. Schematic Diagram - MAIN Section (2/4) - ............. 29 7-9. Schematic Diagram - MAIN Section (3/4) - ............. 30 7-10. Schematic Diagram - MAIN Section (4/4) - ............. 31 7-11. Printed Wiring Board - MPEG Section (Side A) - .... 32 7-12. Printed Wiring Board - MPEG Section (Side B) - .... 33 7-13. Schematic Diagram - MPEG Section (1/3) - ............ 34 7-14. Schematic Diagram - MPEG Section (2/3) - ............ 35 7-15. Schematic Diagram - MPEG Section (3/3) - ............ 36 7-16. Printed Wiring Boards - KEY Section - .................... 37 7-17. Schematic Diagram - KEY Section - ........................ 38 7-18. Schematic Diagram - MIC CONTROL Section - ..... 39 7-19. Printed Wiring Board - AV Section - ......................... 40 7-20. Schematic Diagram - AV Section - ........................... 40 7-21. Printed Wiring Board - AMP Section - ..................... 41 7-22. Schematic Diagram - AMP Section - ........................ 42 7-23. Printed Wiring Board - POWER Section - ................ 43 7-24. Schematic Diagram - POWER Section - .................. 44 8. EXPLODED VIEWS 8-1. Overall Section ................................................................ 55 8-2. Front Panel Section ......................................................... 56 8-3. Chassis Section ................................................................ 57 8-4. DVD Mechanism Deck Section ...................................... 58 9. ELECTRICAL PARTS LIST .................................. 59