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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
1. GENERAL
ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááá 3
2. DISASSEMBLY
2-1. Case ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááááááááááááááááá 4
2-2. Front Panel Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááá 4
2-3. PRE Board ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááááááá 5
2-4. Function board, Relay board, SP TM board, Trans board,
Power board ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááááá 5
2-5. Mechanism Deck ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááá 6
2-6. Chassis (T2) Assy ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááá 6
2-7. BD Board ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááááááááá 7
2-8. Roller Arm Block Assy ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááá 7
2-9. Chassis (OPT), Chucking Arm Assy áááááááááááááááááááááááááááááááááá 8
2-10. Motor (SL) Assy (M102), Optical Pick-Up áááááááááááááááááááááááá 8
3. TEST MODE ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááá 9
4. ELECTRICAL ADJUSTMENT áááááááááááááááááááááááááááááá 11
5. DIAGRAMS
5-1. Circuit Boards Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\
14
5-2. Block Diagram ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááá 15
5-3. Schematic Diagram ÐBD SectionÐ ááááááááááááááááááááááááááááááááááá 18
5-4. Printed Wiring Board ÐBD SectionÐ áááááááááááááááááááááááááááááááá 21
5-5. Printed Wiring Board ÐPanel SectionÐ ááááááááááááááááááááááááááááá 23
5-6. Schematic Diagram ÐPanel Section Ð áááááááááááááááááááááááááááááá 25
5-7. Printed Wiring Board ÐPRE SectionÐ áááááááááááááááááááááááááááááá 27
5-8. Schematic Diagram ÐPRE SectionÐ ááááááááááááááááááááááááááááááááá 29
5-9. Printed Wiring Board ÐFunction SectionÐ ááááááááááááááááááááááá 31
5-10. Schematic Diagram ÐFunction SectionÐ áááááááááááááááááááááááááá 33
5-11. Printed Wiring Board ÐPower SectionÐ ááááááááááááááááááááááááááá 36
5-12. Schematic Diagram ÐPower SectionÐ áááááááááááááááááááááááááááááá 39
5-13. IC Pin Function ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááá 42
5-14. IC Block Diagrams ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááá 44
6. EXPLODED VIEWS
6-1. Front Panel Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááá 47
6-2. Chassis Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááá 48
6-3. Mechanism Deck Section-1 (CDM50) ááááááááááááááááááááááááááááá 49
6-4. Mechanism Deck Section-2 (CDM50) ááááááááááááááááááááááááááááá 50
7. ELECTRICAL PARTS LIST ááááááááááááááááááááááááááááááááááá 51
OutputsVIDEO/PC OUT jack : Stereo phone
jack, 250mV, 1kW
DIGITAL OUT (CD OPTICAL OUT):
Square optical connector jack, Ð18dBm,
wave jength 660nm
PHONES (headphones) jack :
Stereo mini jack, accepts head phones of
8W or more.
General
Power requirements
European model220Ð230V AC, 50/60Hz
Other models110Ð120V or 220Ð240V
AC, 50/60Hz adjustable
with voltage selector
Power consumption66W (when connected to TC-TX101,
MDS-MX101)
DimensionsApprox. 142´125´260mm (w/h/d) incl.
projecting parts and controls
MassApprox. 4.1kg
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
·Never reuse a disconnected chip component.
·Notice that the minus side of a tantalum capacitor may be damaged
by heat.
Flexible Circuit Board Repairing
·Keep the temperature of soldering iron around 270 ûC during
repairing.
·Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
·Be careful not to apply force on the conductor when soldering or
unsoldering.
SERVICE NOTE
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SECTION 1
GENERAL This section is extracted
from instruction manual.
1Remote control signal sensor
2Power switch
3CD insertion slot
4Display window
56 (CD EJECT) button
6PHONES terminal
7BAND button
8DBFB button
9=0/)+ (Cue-up musics, or fast rewind / fast
forward) button
0VOL+/Ð button
!Á^ (CD playback or pause) button
!ªFUNCTION button
!£p (CD stop) button
