Sony excd 51 service manual

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TABLE OF CONTENTS

Specifications .... 1
Servicing Notes .. 2
GENERAL
Location of Controls . 3
Installation .. 4
Connections 5
DISASSEMBLY ........................................................ 8
TEST MODE 9
ELECTRICAL ADJUSTMENTS
Tuner Section 9
CD Section .. ll
DIAGRAMS
Printed Wiring Boards
- Mechanism Deck Section - ......................................... 14
Schematic Diagram
- Mechanism Deck Section - ........ . 17
Schematic Diagram - Main Section , 22
Printed Wiring Board - Main Section - .. i 27
Printed Wiring Board - Display Section . 29
Schematic Diagram - Display Section - . 31
IC Pin Function Description ................. . 33
EXPLODED VIEWS ................................................ 35
ELECTRICAL PARTS LIST ........................... 39

SERVICING NOTES

Laser Diode Properties

° Material: GaAlAs

° Wavelength: 780 nm

° Emission Duration: continuous

° Laser Output Power: less than 44.6 pW*

* This output is the value measured at a distance of 200

mm from the objective lens surface on the Optical Pick-
up Block.

CAUTION

Use of controls or adjustments or performance of pro-
cedures other than those specified herein may result in
hazardous radiation exposure.

NOTES ON HANDLING THE OPTICAL
PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer elec-
trostatic breakdown because of the potential difference gen-
erated by the charged electrostatic load, etc. on clothing and
the human body.

During repair, pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is included
in the repair pans.

The flexible board is easily damaged and should be handled
with care.

Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around 270 °C
during repairing.

0 Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).

a Be careful not to apply force on the conductor when solder-
ing or unsoldering.

Notes on chip component replacement

0 Never reuse a disconnected chip component.
o Notice that the minus side of a tantalum capacitor may be
damaged by heat.

SAFETY-RELATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.