Sony excd 21 service manual

Page 1

CDX-2100/EXCD-21

SERVICE MANUAL us Model

CDX-2100

Canadian Model

EX CDv2 1

sEEEnEEnile

Photo: COX-2100

Model Name Using Similar Mechanism NEW
CD Drive Mechanism Type MG-333X-121
Optical Pick-Up Name KSS-520A

SPECIFICATIONS
AUDIO POWER SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

7 watts per channel minimum continuous average power into

4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than
1 % total harmonic distortion.

CD player section

System Compact disc digital audio Separation 33 dB at 1 kHz Dimemions Approx. 178 x 50 x 180 mm
system Frequency response 30 - 15,000 Hz (7 /I X 2 x 7 /u in.)
Signal-to- noise ratio 90 dB Capture ratio 2 dB (W/h/d)
Frequency response 10 - 20,000 Hz Mounting dimension Approx. 183 x 53 x 159 mm
Wow and flutter Below measurable limit AM (7 '/4x 2 /-x6/iin.)
Laser Diode Properties Tuning range 530 - 1,710 kHz (w/h/d)
Material CaAlAS Antenna terminal External antenna connector M355 Appmx. 12 Kg (2 lb to oz.)
Wavelength 780 nm [(Qnncdhtc frequency 450 kHz Supplied accessories Parts for installation and
Emission Duration Continuous Sensitivity 32 v connections (I set)

Laser output power Less than 44.6 uW'

This output is the vain: measured am distance ofzoo Power amplifier section

mm from the objective lens surface on the Optical Pick- Design and specifimtions are subject to change without

up Block. Outputs Speaker outputs notice
(sure seal connectors)
Speaker impedance , 4 - 8 ohms

Tuner SECtIOI" Maximum power output 20 W x 4 (at 4 ohms)

FM
Tuning range 87.5 -107,9 MHz
Antenna terminal External antenna connector General
intermediate frequency 10.7 MHz Output lead Power antenna control /
Usable sensitivity 13 dBf POWer amplifier control
Selectivity 70 dB at 400 kHz lead
Signal-to-noise ratio 65 dB (stereo), Tone controls Bass :10 dB at 100 Hz
68 dB (mono) Treble :10 dB at I0 kHz
Harmonic distortion at 1 kHz Power requirements 12 V DC car battery
0.5 "Ia (stereo), (negative ground)

0.3 % (mono)

FM/AM COMPACT DISC PLAYER

SONY;

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TABLE OF CONTENTS

1. GENERAL

Location of Controls . 3

Installation . 4

Connections .. 5
2. DISASSEMBLY ........................................................ 7
3. TEST MODE ............................................................ 11
4. ELECTRICAL ADJUSTMENTS

Timer Section . 11

CD Section. l3
5. DIAGRAMS
S-ll IC Pin Function Description ........................................... 14
5-2. Printed Wiring Boards

- Mechanism Deck Section - ......................................... 16
5-3. Schematic Diagram - Mechanism Deck Section .. 19
54. Schematic Diagram - Main, Key Section - ..... .. 23
5-5. Printed Wiring Boards - Main, Key Section - ............. 27
6. EXPLODED VIEWS ................................................ 33
7. ELECTRICAL PARTS LIST ............................... 38

SAFETY-RELATED COMPONENT WARNING

COMPONENTS IDENTIFIED BY MARK A OR DOTIED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL T0 SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

ADDITIONAL
INFORMATION

SE

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL
PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer elec-
trostatic breakdown because of the potential difference gen-
erated by the charged electrostatic load, etc. on clothing and
the human body.

During repair, pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is included
in the repair parts,

The flexible board is easily damaged and should be handled
with care.

Laser Diode Propcrites

- Material: GaAlAs

- Wavelength: 780 nm

° Emission Duration: continuous

0 Laser Output Power: less than 44.6 LIW*

* This output is the value measured at a distance of 200mm

from the objective lens surface on the Optical Pick-up
Block,

CAUTION

Use of controls or adjustments or performance of pro-
cedures other than those specified herein may result in
hazardous radiation exposure.

Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around 270 C
during repairing.

- Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).

0 Be careful not to apply force on the conductor when solder-
ing or unsolderingl

Notes on chip component replacement

0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may be
damaged by heat.

ArrEN'non AU COMPOSANT AYANT RAPPORT
A LA sEcunrrEi

LEs COMPOSANTS IDENTIFIES PAR UNE MAROUE A
sun LES DIAGRAMMES scuEMAnoUES ET LA USTE
DES PIECES SONT camouEs POUR LA sEcumTE
DE FONCTIONNEMENT. NE REMPLACER CES com-
POSANTS QUE PAR DES PIEcEs SONY DONT LES
NUMEROS som DONNES DANS CE MANUEL ou DANS
LES SUPPLEMENTS PUBLIEs PAR SONY.