Page 1
ECM-DM5P
2
z UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder. Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SECTION 1
SERVICING NOTES
1 Twist the lead wire show in
arrow direction.
2 Insert the lead wire then return twist.
4 Soldering white lead wire.
5 Screen.
3 Soldering gray
lead wire
to "V" shape
patarn side.
7 Insert the MIC1.
Paying attention as
lead wire isn't niped in.P1
Lead wire (A32)
Case, microphone
Arm (rear)
Arm (front)
C1
MIC1
OK
MIC1
Arm (front)
Arm (front) NG
MIC1MIC1
8
6
Note:
When remove solder front P1,
change the lead wire
(A32) for new one.
MIC1 INSTALLATION
