Sony dvx 11 b service manual

Page 1

2 DVX-11B This label is located on the bottom of the chassis. CAUTION INVISIBLE DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTS LASER RADIATION WHEN OPEN This label is located on the drive units internal chassis. laser-tap Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Ke ep the temperature of the soldering iron around 270 °C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. T he laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK . The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD Laser Diode Properties - Material: GaAlAs - Wa velength: 780 nm - Emission Duration: continuous - Laser Output Power: less than 44.6 µW* *T his output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block. W hen replacing the CHASSIS BASE of mechanism deck which have the CAUTION LABEL attached, please be sure to put a new CAUTION LABEL (3-223-913-11) to the CHASSIS BASE. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Page 2

3 DVX-11B TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL Location of Controls ....................................................... 7 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 11 3-2. Cove r........................................................................\ ....... 12 3-3. Front P anel Assy............................................................. 12 3-4. Mechanism Deck (SA-MDAM01)................................. 13 3-5. DSP Board, MAIN Board............................................... 13 3-6. Brack et L/R..................................................................... 14 3-7. Chassis (DVD) Block...................................................... 14 3-8. SERVO Board................................................................. 15 3-9. Gear Cove r...................................................................... 15 3-10. Feed Motor (Loading) (M1)........................................... 16 3-11. Chassis Clamp ................................................................. 16 3-12. Brack et Roller................................................................. 17 4. ELECTRICAL ADJUSTMENTS ......................... 17 5. DIAGRAMS 5-1. Block Diagram ................................................................ 18 5-2. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 19 5-3. Printed Wiring Boards -“ MAIN Section (1/2) -“........... 20 5-4. Printed Wiring Boards -“ MAIN Section (2/2) -“........... 21 5-5. Schematic Diagram -“ MAIN Section (1/2) -“................ 22 5-6. Schematic Diagram -“ MAIN Section (2/2) -“................ 23 5-7. Printed Wiring Board -“ KEY Board -“........................... 24 5-8. Schematic Diagram -“ KEY Board -“............................. 25 6. EXPLODED VIEWS 6-1. Overall Section................................................................ 29 6-2. Front P anel Section......................................................... 30 6-3. Chassis Section ............................................................... 31 6-4. Mechanism Deck Section-1 (SA-MDAM01) ................. 32 6-5. Mechanism Deck Section-2 (SA-MDAM01) ................. 33 7. ELECTRICAL PARTS LIST ............................... 34