Sony dvx 100 s service manual

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2 DVX-100S Notes on chip component replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. T he laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK . T he laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD laser-tap

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3 DVX-100S TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 9 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 13 3-2. Cabinet Assy.................................................................... 14 3-3. Front P anel Assy............................................................. 14 3-4. MPEG Board ................................................................... 15 3-5. MAIN Board ................................................................... 15 3-6. Mechanism Deck ............................................................. 16 3-7. Top Chassis Assy............................................................ 16 3-8. DC Motor Assy (Ele vator) (M1) ..................................... 17 3-9. Mechanism Panel Assy, Elevator Section....................... 17 3-10. DC Motor Assy (Loading) (M3)..................................... 18 3-11. CD Board ........................................................................\ . 18 3-12. DVD Chassis Assy.......................................................... 19 4. ASSEMBLY 4-1. Adjusting Phase of A Slide Plate, B Slide Plate, C Slide Plate and D Slide Plate...................................... 20 5. ELECTRICAL ADJUSTMENTS ......................... 21 6. DIAGRAMS 6-1. Block Diagram -“ SERVO Section -“.............................. 23 6-2. Block Diagram -“ VIDEO/AUDIO Section -“................ 24 6-3. Block Diagram -“ MAIN Section -“................................ 25 6-4. Block Diagram -“ CONTROL/POWER Section -“......... 26 6-5. Note for Printed Wiring Boards and Schematic Diagrams ................................................ 27 6-6. Printed Wiring Boards -“ SERVO Section -“.................. 28 6-7. Schematic Diagrams -“ SERVO Section -“..................... 29 6-8. Printed Wiring Board -“ MAIN Board (Side A) -“......... 30 6-9. Printed Wiring Board -“ MAIN Board (Side B) -“......... 31 6-10. Schematic Diagram -“ MAIN Section (1/4) -“................ 32 6-11. Schematic Diagram -“ MAIN Section (2/4) -“................ 33 6-12. Schematic Diagram -“ MAIN Section (3/4) -“................ 34 6-13. Schematic Diagram -“ MAIN Section (4/4) -“................ 35 6-14. Printed Wiring Board -“ MPEG Board (Component Side) -“.............................. 36 6-15. Printed Wiring Board -“ MPEG Board (Conductor Side) -“................................ 37 6-16. Schematic Diagram -“ MPEG Section (1/4) -“............... 38 6-17. Schematic Diagram -“ MPEG Section (2/4) -“............... 39 6-18. Schematic Diagram -“ MPEG Section (3/4) -“............... 40 6-19. Schematic Diagram -“ MPEG Section (4/4) -“............... 41 6-20. IC Pin Function Description........................................... 45 7. EXPLODED VIEWS 7-1. Front Panel, Cabinet Section.......................................... 48 7-2. MPEG Board Section...................................................... 49 7-3. Bottom Lid Section......................................................... 50 7-4. Mechanism Deck (T op Chassis Section)........................ 51 7-5. Mechanism Deck (Front Plate, Slide Plate Section)...... 52 7-6. Mechanism Deck (Base Chassis Section)...................... 53 7-7. Mechanism Deck (D VD Chassis Section)..................... 51 7-8. Mechanism Deck (Ele vator Chassis Section) ................ 55 7-9. Mechanism Deck (Clamp Chassis Section)................... 56 8. ELECTRICAL PARTS LIST ............................... 57