Sony dvps 9 service manual

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2 DVP-S9 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board. (within 3 times) -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTIONThe use of optical instruments with this product will increase eye hazard. As the laser beam used in this CD/DVD Player is harmful to eyes, do not attempt to disassemble the cabinet. Refer servicing to qualified personnel only. The following caution label is located inside the apparatus.

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3 DVP-S9 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Cover ............................................................................... 7 3-3. CD Mechanism Deck (CDM63D) .................................. 7 3-4. MB Board ........................................................................ 8 3-5. VIDEO Board .................................................................. 8 3-6. MAIN Board ................................................................... 9 3-7. Front Panel Section ......................................................... 9 3-8. PANEL Board, SUB PANEL Board ............................... 10 3-9. Lid (CD) .......................................................................... 10 4. TEST MODE .............................................................. 11 5. ELECTRICAL ADJUSTMENTS ......................... 12 6. DIAGRAMS 6-1. Block Diagram -“ RF/SERVO Section -“........................ 13 6-2. Block Diagram -“ MAIN Section (1/2) -“....................... 14 6-3. Block Diagram -“ MAIN Section (2/2) -“....................... 15 6-4. Block Diagram -“ INTERFACE CONTROL Section -“............................ 16 6-5. Note For Printed Wiring Boards and Schematic Diagrams ................................................ 17 6-6. Printed Wiring Board -“ RF Board -“.............................. 18 6-7. Schematic Diagram -“ RF Board -“................................. 19 6-8. Printed Wiring Boards -“ DISC SENSOR/DRIVER/ IN OUT SW/MOTOR/TRAY SENSOR Boards -“......... 20 6-9. Schematic Diagram -“ DISC SENSOR/DRIVER/ IN OUT SW/MOTOR/TRAY SENSOR Boards -“......... 21 6-10. Printed Wiring Board -“ MB Board (Component Side) -“................................... 22 6-11. Printed Wiring Board -“ MB Board (Conductor Side) -“..................................... 23 6-12. Schematic Diagram -“ MB Board (1/6) -“....................... 24 6-13. Schematic Diagram -“ MB Board (2/6) -“....................... 25 6-14. Schematic Diagram -“ MB Board (3/6) -“....................... 26 6-15. Schematic Diagram -“ MB Board (4/6) -“....................... 27 6-16. Schematic Diagram -“ MB Board (5/6) -“....................... 28 6-17. Schematic Diagram -“ MB Board (6/6) -“....................... 29 6-18. Printed Wiring Board -“ MAIN Board -“........................ 30 6-19. Schematic Diagram -“ MAIN Board -“........................... 31 6-20. Printed Wiring Boards -“ PANEL/SUB PANEL/VIDEO Boards -“..................... 32 6-21. Schematic Diagram -“ PANEL/SUB PANEL/VIDEO Boards -“..................... 33 6-22. IC Pin Function Description ........................................... 37 7. EXPLODED VIEWS 7-1. Case Section .................................................................... 47 7-2. Front Panel Section ......................................................... 48 7-3. Chassis Section ............................................................... 49 7-4. CD Mechanism Deck Section-1 (CDM63D) ................. 50 7-5. CD Mechanism Deck Section-2 (CDM63D) ................. 51 7-6. CD Mechanism Deck Section-3 (CDM63D) ................. 52 7-7. CD Mechanism Deck Section-4 (CDM63D) ................. 53 7-8. Optical Pick-up Section .................................................. 54 8. ELECTRICAL PARTS LIST ............................... 55