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TAP802
-“ main board (side A) -“
S801
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Flexible Circuit Board Repairing
-Keep the temperature of the soldering iron around 270°C during
repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on Chip Component Replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat.This Compact Disc player is
classified as a CLASS 1
LASER product.
The CLASS 1 LASER
PRODUCT table is located
on the bottom exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Precautions for Checking Emission of Laser Diode
Laser light of the equipment is focused by the object lens in the
optical pick-up so that the light focuses on the reflection surface
of the disc. Therefore, be sure to keep your eyes more then 30 cm
apart from the object lens when you check the emission of laser
diode.
Before Replacing the Optical Pick-Up Block
Please be sure to check throughly the parameters as par the Opti-
cal Pick-Up Block Checking Procedures (Part No.: 9-960-027-
11) issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
- FOK output : IC601 eg pin
When checking FOK, remove the lead wire to disc motor.
- RF signal P-to-P value : 0.35 - 0.65 Vp-pLaser Diode Checking Methods
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S801. (push switch type)
The following two checking methods for the laser diode are
operable.
- Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S801 with a screwdriver having a
thin tip as shown in Fig.1.
or TAP802 is shorted as shown in Fig.2.
Note:Do not push the detection lever strongly, or it may be bent
or damaged.
3. Press the u button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power
control circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 5
times along with inward motion for the focus search.
Fig. 2 Fig. 1
detection lever
detection lever
main board S801
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TABLE OF CONTENTS
1. GENERAL
Getting started ......................................................................... 4
Playing a VIDEO CD .............................................................. 4
Playing an audio CD ................................................................ 5
2. DISASSEMBLY
2-1. Cabinet (Lower) Assy ......................................................... 6
2-2. Lid Assy, Upper ................................................................... 6
2-3. Switch Board ....................................................................... 7
2-4. MD Assy ............................................................................. 7
2-5. Main Board, IR Board ......................................................... 8
2-6. Optical Pick-up ................................................................... 8
3. TEST MODE
3-1. How to Enter the Test Mode ................................................ 9
3-2. How to Release the Test Mode ............................................ 9
3-3. Each Key Function in Test Mode ........................................ 9
4. ELECTRICAL ADJUSTMENT
4-1. Focus Bias Check .............................................................. 11
5. DIAGRAMS
5-1. IC Pin Descriptions ........................................................... 12
5-2. Block Diagram -“CD Section (1/2)-“ .................................. 17
5-3. Block Diagram -“CD Section (2/2)-“ .................................. 19
5-4. Block Diagram -“Video Section-“ ....................................... 21
5-5. Block Diagram -“Power Supply Section-“ .......................... 23
5-6. Printed Wiring Boards ....................................................... 25
5-7. Schematic Diagram -“Main Section (1/4)-“ ........................ 29
5-8. Schematic Diagram -“Main Section (2/4)-“ ........................ 31
5-9. Schematic Diagram -“Main Section (3/4)-“ ........................ 33
5-10. Schematic Diagram -“Main Section (4/4)-“ ........................ 35
6. EXPLODED VIEWS
6-1. Cabinet Section ................................................................. 41
6-2. CD Mechanism Deck Section ........................................... 42
7. ELECTRICAL PARTS LIST ........................................ 43
