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D-SJ303
Specifications ........................................................................\
.... 1
1. SERVICING NOTE ................................................... 3
2.GENERAL ................................................................... 3
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 4
3-2. Lid Upper, Cabinet (Front) .......................................... 4
3-3. MD Assy, Main Board ..................................................... 4
3-4. Motor Assy , Turn Table (Spindle) (M901) ................. 5
3-5. Motor Assy (Sled) (M902),
Optical Pick-Up (DAX-25E) ........................................... 5
4. ELECTRICAL ADJUSTMENT ............................. 6
5. DIAGRAMS
5-1. IC Pin Function Description ............................................ 7
5-2. Block Diagrams ............................................................... 11
5-3. Printed Wiring Boards -“ Main Section (1/2) -“ ................ 12
5-4. Printed Wiring Boards -“ Main Section (2/2) -“ ................ 13
5-5. Schematic Diagram -“ Main Board (1/3) -“ ...................... 14
5-6. Schematic Diagram -“ Main Board (2/3) -“ ...................... 15
5-7. Schematic Diagram -“ Main Board (3/3) -“ ...................... 16
6. EXPLODED VIEWS
6-1. Upper Lid Section ........................................................... 18
6-2. Cabinet Section ................................................................ 19
6-3. Optical Pick-Up Section (CDM-3125ER) ....................... 20
7. ELECTRICAL PARTS LIST .................................. 21
TABLE OF CONTENTS
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
D ANGER
Invisible laser radiation when open and interlock failed or defeated.
A void direct exposure to beam.
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
Notes on chip component replacement -Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270ËšC
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Ve r. 1.1
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PA RTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
A TTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
