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D-NE710/NE711/NE715/NE718CK
Flexible Circuit Board Repairing
-Keep the temperature of the soldering iron around 270 ËšC dur-
ing repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Disconnect all power sources when the CD player is not used for a long time.
On AC power adaptor
-Use only the AC power adaptor supplied.
If your CD player is not supplied with the one, use the AC-E45HG AC
power adaptor. Do not use any other AC power adaptor. It may cause a
malfunction.
Polarity of the plug
-Do not touch the AC power adaptor with wet hands.
-Connect the AC power adaptor to an easily accessible AC outlet. Should
you notice an abnormality in the AC power adaptor, disconnect it from
the AC outlet immediately.
Notes on the power source
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 3
2. GENERAL ·········································································· 4
3. DISASSEMBLY ································································ 5
4. ELECTRICAL CHECKING ··········································· 8
5. DIAGRAMS ········································································ 9
5-1. Block Diagram -“ MAIN Section (1/2) -“ ····················· 10
-“ MAIN Section (2/2) -“ ··············································· 11
-“ Power Supply Section -“ ··········································· 12
5-2. Printed Wiring Board -“ MAIN Board (Side A) -“ ······· 13
5-3. Printed Wiring Board -“ MAIN Board (Side B) -“ ······· 14
5-4. Schematic Diagram -“ MAIN Board (1/4) -“ ··············· 15
5-5. Schematic Diagram -“ MAIN Board (2/4) -“ ··············· 16
5-6. Schematic Diagram -“ MAIN Board (3/4) -“ ··············· 17
5-7. Schematic Diagram -“ MAIN Board (4/4) -“ ··············· 18
5-8. IC Block Diagrams ······················································ 19
5-9. IC Pin Function Descriptions ······································ 22
6. EXPLODED VIEWS ······················································ 27
7. ELECTRICAL PARTS LIST ······································· 30
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
-Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
-Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
-Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
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D-NE710/NE711/NE715/NE718CK
SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the Optical
Pick-Up Block Checking Procedures (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
-FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
-RF signal P-to-P value: 0.4 to 0.6 Vp-p
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S801. (push switch type)
The following checking method for the laser diode is operable.
-Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S801 with a screwdriver having a
thin tip as shown in Fig.1.
3. Press the> Bbutton.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S801
S801detection lever
detection lever
MAIN board