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D-NE309LIV2
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 C dur-
ing repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering. TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 3
2. GENERAL ................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow........................................................... 5
3-2. Cabinet (Lower) Section................................................. 5
3-3. Optical Pick-up Assy (CDM-3325ER)........................... 6
3-4. MAIN Board................................................................... 6
3-5. Liquid Crystal Display Panel (LCD2001),
SWITCH Board............................................................... 7
4. TEST MODE .............................................................. 8
5. ELECTRICAL CHECK .......................................... 9
6. DIAGRAMS
6-1. Block Diagram................................................................ 10
6-2. Note for Printed Wiring Boards and
Schematic Diagrams....................................................... 11
6-3. Printed Wiring Board
- MAIN Board (Component Side) -.............................. 12
6-4. Printed Wiring Board
- MAIN Board (Conductor Side) -................................ 13
6-5. Schematic Diagram - MAIN Board (1/4) -.................. 14
6-6. Schematic Diagram - MAIN Board (2/4) -.................. 15
6-7. Schematic Diagram - MAIN Board (3/4) -.................. 16
6-8. Schematic Diagram - MAIN Board (4/4) -.................. 17
6-9. Printed Wiring Board - SWITCH Board -................... 18
6-10. Schematic Diagram - SWITCH Board -...................... 19
7. EXPLODED VIEWS
7-1. Cabinet (Inner) Section................................................... 26
7-2. Cabinet (Upper) Section................................................. 27
7-3. Cabinet (Lower) Section................................................. 28
7-4. Optical Pick-up Section (CDM-3325ER)....................... 29
8. ELECTRICAL PARTS LIST ............................... 30CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
On AC power adaptor
Β₯Use only the AC power adaptor supplied.
If your CD player is not supplied with the
one, use the AC-E45HG AC power
adaptor. Do not use any other AC power
adaptor. It may cause a malfunction.
Polarity of the plug
About CD-Rs/RWsThis CD player can play CD-Rs/RWs recorded in the ATRAC3plus/ATRAC3, MP3 or CDDA*
format, but playback capability may vary depending on the quality of the disc and the condition
of the recording device.
*CDDA is the abbreviation for Compact Disc Digital Audio. It is a recording standard used for the Audio
CDs.
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D-NE309LIV2
Sy s t e m re qu ire m e n t s
The following hardware and software specifications are required in order to use the SonicStage
Simple Burner software.
Comput er I B M P C/AT or Compat i bl e
-CPU: Pentium I I 300 M Hz or hi gher ( Pent i um III 600 M H z or hi gher i s
recommended. )
-Har d di sk dr i v e space: Sy st em f ol der ( on boot di sc) - 2 0 0 M B or mor e/
Tempor ar y f ol der - 200 M B or more ( T he amount of f r ee space
required differs accor di ng t o t he si z e of t he audi o files that you want to
handl e. 1 . 5 G B of f r ee space or mor e i s r ecommended. )
-RAM: 64 MB or mor e ( 1 2 8 M B or mor e i s r ecommended)
Others - CD - R/RW drive (capable of di gi t al pl ay back by
WDM )
-Sound B oar d
Operat i ng Sy st em F act or y i nst al l ed:
Window s X P H ome E di t i on/Window s X P Pr of essi onal/Window s
Millennium Edition/Window s 2000 Prof essi onal/Window s 9 8 Second
Edi tion
DisplayHigh Col or ( 16 bi t) or hi gher, 800 Γ 600 dots or betterOther s - I nt er net access: f or W eb r egi st r at i on and C D D B ser v i ces
-Adobe A cr obat R eader i nst al l ed f or v i ew i ng t he PD F manual
This software is not s upported by the following environments :-NEC PC - 9 8 ser i es or compat i bl e machi nes, M aci nt osh sy st ems
-Window s X P v er si ons ot her t han H ome E di t i on or Pr of essi onal
-Window s 2000 versi ons other than Prof essi onal
-Window s 9 8 v er si ons ot her t han Second E di t i on
-Window s N T
-Window s 9 5
-Personal l y const r uct ed PC s or oper at i ng sy st ems
-An env i r onment t hat i s an upgr ade of t he or i gi nal manuf act ur er - i nst al l ed oper at i ng sy st em
-Mul t i - boot env i r onment
-Mul t i - moni t or env i r onment
No t e s
-We do not ensur e t r oubl e- f r ee oper at i on on al l comput er s t hat sat i sf y t he sy st em r equi r ement s.
-We do not ensur e t r oubl e- f r ee oper at i on of t he sy st em suspend, sl eep, or hi ber nat i on f unct i on on al l
comput er s.
3. Push the N X button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power
control circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the Op-
tical Pick-Up Block Checking Procedures (Part No.: 9-960-027-
11) issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
RF signal P-to-P value: 0.45 to 0.65 Vp-p
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S820. (push switch type)
The following checking method for the laser diode is operable.
-Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S820 with a screwdriver having
a thin tip as shown in Fig.1.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S804
S820detection lever detection lever
MAIN board
In performing the repair with the power supplied to the set, re-
moving the MAIN board causes the set to be disabled.
In such a case, make a solder bridge to short SL825 (OPEN/
CLOSE DETECT) on the MAIN board in advance.
- MAIN Board (Component Side) -
SL825
(OPEN)
