Sony d ne 300 ck service manual

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2 D-NE300/NE300CK/NE301/NE301CK/NE306CK Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL ................................................................... 4 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 5 3-2. Cabinet (Low er) Section................................................. 5 3-3. Optical Pick-up Assy (CDM-3325ER) ........................... 6 3-4. MAIN Board ................................................................... 6 3-5. Liquid Crystal Display Panel (LCD2001), SWITCH Board ............................................................... 7 4. TEST MODE .............................................................. 8 5. ELECTRICAL CHECK .......................................... 9 6. DIAGRAMS 6-1. Block Diagram ................................................................ 10 6-2. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 11 6-3. Printed Wiring Board -“ MAIN Board (Component Side) -“.............................. 12 6-4. Printed Wiring Board -“ MAIN Board (Conductor Side) -“................................ 13 6-5. Schematic Diagram -“ MAIN Board (1/4) -“.................. 14 6-6. Schematic Diagram -“ MAIN Board (2/4) -“.................. 15 6-7. Schematic Diagram -“ MAIN Board (3/4) -“.................. 16 6-8. Schematic Diagram -“ MAIN Board (4/4) -“.................. 17 6-9. Printed Wiring Board -“ SWITCH Board -“................... 18 6-10. Schematic Diagram -“ SWITCH Board -“...................... 19 7. EXPLODED VIEWS 7-1. Cabinet (Inner) Section................................................... 26 7-2. Cabinet (Upper) Section................................................. 27 7-3. Cabinet (Low er) Section................................................. 28 7-4. Optical Pick-up Section (CDM-3325ER)....................... 29 8. ELECTRICAL PARTS LIST ............................... 30 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. A TTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ËšC higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ËšC. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges oc- cur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. On AC power adaptor Â¥Use only the AC power adaptor supplied. If your CD player is not supplied with the one, use the AC-E45HG AC power adaptor. Do not use any other AC power adaptor. It may cause a malfunction. Polarity of the plug About CD-Rs/RWsThis CD player can play CD-Rs/RWs recorded in the ATRAC3plus/ATRAC3, MP3 or CDDA* format, but playback capability may vary depending on the quality of the disc and the condition of the recording device. *CDDA is the abbreviation for Compact Disc Digital Audio. It is a recording standard used for the Audio CDs.

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3 D-NE300/NE300CK/NE301/NE301CK/NE306CK Sys tem requirements The following hardware and software specifications are required in order to use the SonicStage Simple Burner software. C omput er I B M P C /AT or Compat i bl e -CP U: Pentium I I 300 M Hz or hi gher ( Pent i um III 600 M H z or hi gher i s r ecommended. ) -H ar d di sk dr i v e space: Sy st em f ol der ( on boot di sc) -“ 2 0 0 M B or mor e/ Te mpor ar y f ol der -“ 200 M B or more ( T he a mount of f r ee space re qui red differs accor di ng t o t he si z e of t he audi o files that you want to handl e. 1 . 5 G B of f r ee space or mor e i s r ecommended. ) -R AM : 64 MB or mor e ( 1 2 8 M B or mor e i s r ecommended) Others - CD - R /RW drive (capable of di gi t al pl ay back by WDM ) - Sound B oar d Oper at i ng Sy st em F act or y i nst al l ed: Window s X P H ome E di t i on /Window s X P Pr of essi ona l/Window s M illennium Edition/Wi ndow s 2000 Prof essi ona l/Window s 9 8 Second Edi t ion Display High Col or ( 16 bi t) or hi gher, 800 × 600 dots or betterOt her s - I nt er net access: f or W eb r egi st r at i on and C D D B ser v i ces -Adobe A cr obat R eader i nst al l ed f or v i ew i ng t he PD F manual This so ftwa re is not s upported by the following environments :-N EC PC - 9 8 ser i es or compat i bl e machi nes, M aci nt osh sy st ems - Wi ndow s X P v er si ons ot her t han H ome E di t i on or Pr of essi onal - Wi ndow s 2000 versi ons other than Prof essi onal - Wi ndow s 9 8 v er si ons ot her t han Second E di t i on - Wi ndow s N T - Wi ndow s 9 5 -Pers onal l y const r uct ed PC s or oper at i ng sy st ems -A n env i r onment t hat i s an upgr ade of t he or i gi nal manuf act ur er - i nst al l ed oper at i ng sy st em -M ul t i - boot env i r onment -M ul t i - moni t or env i r onment No t e s -W e do not ensur e t r oubl e- f r ee oper at i on on al l comput er s t hat sat i sf y t he sy st em r equi r ement s. -W e do not ensur e t r oubl e- f r ee oper at i on of t he sy st em suspend, sl eep, or hi ber nat i on f unct i on on al l comput er s. 3. Push the N X b utton. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 4 times along with inward motion for the focus search. SECTION 1 SERVICING NOTES T he laser diode in the optical pick-up block may suffer electro- static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. BEFORE REPLACING THE OPTICAL PICK-UP BLOCK Please be sure to check thoroughly the parameters as par the Op- tical Pick-Up Block Checking Procedures (Part No.: 9-960-027- 11) issued separately before replacing the optical pick-up block. Note and specifications required to check are given below. - FOK output: IC601 yg pin W hen checking FOK, remove the lead wire to disc motor. - RF signal P-to-P value: 0.45 to 0.65 Vp-p LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S820. (push switch type) T he following checking method for the laser diode is operable. - Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S820 with a screwdriver having a thin tip as shown in Fig.1. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT Fig. 1 Method to push the S804 S820 detection lever detection lever MAIN board -In performing the repair with the power supplied to the set, re- moving the MAIN board causes the set to be disabled. In such a case, make a solder bridge to short SL825 (OPEN/ CLOSE DETECT) on the MAIN board in advance. -“ MAIN Board (Component Side) -“ SL825 (OPEN)