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D-NE10
TABLE OF CONTENTS
1. SERVICING NOTE
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2. GENERAL ··················\
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3. DISASSEMBLY ··················\
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3-1. UPPER LID (SUB) ASSY ··················\
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3-2. LIGHT GUIDE LENS ··················\
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3-3. CABINET (INNER) ··················\
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3-4. MAIN BOARD, CD MECHANISM DECK (CDM-3325ER2) ··············· 9
3-5. TURN TABLE MOTOR ASSY (M901), SLED MOTOR ASSY (M902),
OPTICAL PICK-UP (DAX-25E) ··················\
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4. ELECTRICAL CHECKING ··················\
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5. DIAGRAMS ··················\
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5-1. BLOCK DIAGRAM - MAIN SECTION -1 - ··················\
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- MAIN SECTION -2 - ··················\
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- POWER SECTION - ··················\
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5-2. PRINTED WIRING BOARDS - MAIN BOARD (SIDE A) - ··················\
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5-3. PRINTED WIRING BOARDS - MAIN BOARD (SIDE B) - ··················\
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5-4. SCHEMATIC DIAGRAMS - MAIN BOARD (1/4) - ··················\
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5-5. SCHEMATIC DIAGRAMS - MAIN BOARD (2/4) - ··················\
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5-6. SCHEMATIC DIAGRAMS - MAIN BOARD (3/4) - ··················\
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5-7. SCHEMATIC DIAGRAMS - MAIN BOARD (4/4) - ··················\
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5-8. IC PIN FUNCTION DESCRIPTIONS ··················\
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6. EXPLODED VIEWS ··················\
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7. ELECTRICAL PARTS LIST ··················\
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Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40°C higher than
ordinary solder. Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to
about 350°C. Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Flexible Circuit Board Repairing
-K
eep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
-N ever reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
On AC power adaptor
-U se only the AC power adaptor supplied or
recommeded in Accessories (supplied/
optional). Do not use any other AC power
adaptor. It may cause a malfunction.
Polarity of the plug
*1 Measured value by the standard of JEITA (Japan
Electronics and Information Technology
Industries Association)
*2 Charging time varies depending on how the
rechargeable battery is used.
*3 Recorded at 48 kbps
*4 Recorded at 128 kbps
*5 When using Sony alkaline battery LR6 (SG) (produced in Japan)
Supplied accessories
AC po wer adaptor (1)
Rechar geable battery (1)
Battery carrying case (1)
Headphones/earphones (1)
Remote control (1)
Char ging stand (1)
Carrying pouch (1)
External battery case (1)
CD-R OM* (SonicStage Simple Burner) (1)
User s guide for SonicStage Simple Burner (1)
Operating temperature5°C - 35 °C (41 °F - 95 °F)
Dimensions (w/h/d) (excluding
projecting parts and controls)
Approx. 127 × 17.7 × 132.7 mm
(5 × 23-32 × 5 1-4 in.)
Mass (excluding accessories)Approx. 148 g (5.3 oz.)
US and foreign patents licensed from Dolby
Laboratories.
Design and specifications are subject to change
without notice.
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D-NE10
SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens. BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the Optical\
Pick-Up Block Checking Procedures (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
-
FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
- RF signal P-to-P value: 0.45 to 0.65 Vp-p
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S812.
The following checking method for the laser diode is operable.
- Method:
Emission of the laser diode is visually checked.
1. Remove the upper lid.
2. With a disc not set, turn on the S812 with a screwdriver having a thin tip as shown in Fig.1.
3. Press the ubutton.
4. Observing the objective lens, check that the laser diode emits light.
When the laser diode does not emit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
D ANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Fig. 1 Method to push the S812
S81 2
IC601 FOK output ygpin
MAIN BOARD (SIDE B)