Sony d ej 725 service manual

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2 D-E777/EJ721/EJ725 Specifications ............................................................................ 1 1. SERVICING NOTES ................................................... 3 2. GENERAL Locating the Controls ......................................................... 4 3. DISASSEMBLY 3-1. Cabinet (Rear), Cabinet (Front) .................................. 6 3-2. MD ASSY, Main board ............................................... 6 3-3. Motor ASSY, Turn Table (Spindle) (M901) ............ 7 3-4. Motor ASSY (Sled) (M902), Optical Pick-up (DAX-23E) ...................................... 7 3-5. Lid, Upper, Switch Unit .......................................... 7 4. ELECTRICAL ADJUSTMENTS ............................. 8 5. DIAGRAMS 5-1. Explanation of IC Terminals ....................................... 9 5-2. Block Diagram ........................................................... 11 5-3. Printed Wiring Boards -“ Main Section (Side A) -“ ... 12 5-4. Printed Wiring Boards -“ Main Section (Side B) -“ ... 13 5-5. Schematic Diagram -“ Main Section (1/2) -“ ............. 14 5-6. Schematic Diagram -“ Main Section (2/2) -“ ............. 15 6. EXPLODED VIEWS 6-1. Cabinet Section ......................................................... 18 6-2. Optical pick-up Section (CDM-3123EBA) .............. 20 7. ELECTRICAL PARTS LIST ................................... 21 ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. DANGER Invisible laser radiation when open and interlock failed or defeated. Avoid direct exposure to beam. - Abbreviation AUS : Australian FR : French HK : Hong Kong G : German JEW : Tourist CH : Chinese EE : East European KR : Korean E13 : AC220-230V area model E33 : AC100-240V area model Operating temperature 5°C - 35°C (41°F - 95°F) Dimensions (w/h/d) (excluding projecting parts and controls) Approx. 131.6 x 25.5 x 140.9 mm (5 1/4 x 1 1/16 x 5 5/8 in.) Mass (excluding accessories) Approx. 193 g (6.9 oz) Supplied accessories For the area code of the location in which you purchased the CD player, check the upper left side of the bar code on the package. AC power adaptor (1) Headphones/earphones with remote control (1) Rechargeable batteries (2) Battery carrying case (1) Carrying pouch (1)* 1 External battery case (1) AC plug adaptor (1)* 2 *1Not supplied with Canadian, AEP, G, UK, FR and EE models * 2Supplied with JEW and E33 models Design and specifications are subject to change without notice.

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3 D-E777/EJ721/EJ725 The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30cm away from the objective lens. Before Replacing the Optical pick-up Block Please be sure to check thoroughly the parameters as per the Optical pick-up Block Checking Procedure (Part No. : 9-960-027-11) issued separately before replacing the optical Pick-up block. Note and specifications required to check are given below. - FOK output : IC601 eg pin When checking FOK, remove the lead wire to disc motor. - RF signal P-to-P value : 0.45 to 0.65Vp-p (D-E777/EJ725) : 0.38 to 0.6Vp-p (D-EJ721) SECTION 1 SERVICING NOTES Laser Diode Checking Methods During normal operation of the equipment, emission of the laser diode is prohibited unless the upper panel is closed while turning ON the S801 (push switch type). The following checking method for the laser diode are operable. Method : Emission of the laser diode is visually checked. 1. Open the upper lid. 2. Push the S801 as shown in Fig. 1. 3. Check the object lens for confirming normal emission of the laser diode. If not emitting, there is a trouble in the automatic power control circuit or the optical pick-up. During normal operation, the laser diode is turned ON about 2.5 seconds for focus searching. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT Fig.1 Method to push S801 S801