Sony d ej 368 ck service manual

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2 Specifications ........................................................................\ .... 1 1. SERVICING NOTES ................................................... 3 2. GENERAL Locating the Controls ......................................................... 3 3. DISASSEMBLY 3-1. Upper Lid ASSY, Cabinet (Upper) Sub ASSY ........... 4 3-2. MD ASSY, Main Board .............................................. 5 3-3. Motor ASSY (Sled) (M902), Optical Pick-up (DAX-25E), Motor ASSY, Turn Table (Spindle) (M901) ............ 5 4. ELECTRICAL ADJUSTMENS ............................... 6 5. DIAGRAMS 5-1. Block Diagram ............................................................ 7 5-2. Printed Wiring Boards -“MAIN Section (1/2)-“ ........... 8 5-3. Printed Wiring Boards -“MAIN Section (2/2)-“ ........... 9 5-4. Schematic Diagram -“MAIN SECTION (1/3)-“ ....... 10 5-5. Schematic Diagram -“MAIN SECTION (2/3)-“ ........ 11 5-6. Schematic Diagram -“MAIN SECTION (3/3)-“ ....... 12 5-7. IC Pin Function Description ..................................... 16 6. EXPLODED VIEWS 6-1. Cabinet Section ......................................................... 18 6-2. Optical pick-up Section (CDM-3325ER) ................. 19 7. ELECTRICAL PARTS LIST ................................... 20 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PA RTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. T ABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. D ANGER Invisible laser radiation when open and interlock failed or defeated. A void direct exposure to beam. D-EJ360/EJ368CK z UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. V er 1.1 2003.03 A TTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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3 D-EJ360/EJ368CK The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30cm away from the objective lens. Before Replacing the Optical pick-up Block Please be sure to check thoroughly the parameters as per the Optical pick-up Block Checking Procedure (Part No. : 9-960-027-11) issued separately before replacing the optical Pick-up block. Note and specifications required to check are given below. - FOK output : IC601 yg pin When checking FOK, remove the lead wire to disc motor. - RF signal P-to-P value : 0.4 to 0.8Vp-p SECTION 1 SERVICING NOTES Laser Diode Checking Methods During normal operation of the equipment, emission of the laser diode is prohibited unless the upper panel is closed while turning ON the S809 (push switch type). The following two checking methods for the laser diode are operable. Method : Emission of the laser diode is visually checked. 1. Open the upper lid. 2. Push the S809 as shown in Fig. 1 . 3. Check the object lens for confirming normal emission of the laser diode. If not emitting, there is a trouble in the automatic power control circuit or the optical pick-up. During normal operation, the laser diode is turned ON about 2.5 seconds for focus searching. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT Fig.1 Method to push S809 SECTION 2 GENERAL LOCATING THE CONTROLS This section is extracted from instruction manual. S809 CD player (front) CD player (inside) i (headphones) jackDC IN 4.5 V (external powerStrap holes input) jack VOL +*/-“ Battery Compartment.> u* x HOLD OPEN *The button has a tactile dot. Display G-PROTECTION P MODE/ F SOUN/AVLS