Sony d ej 2000 service manual

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2 D-EJ2000 Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. On AC power adaptor -Use only the AC power adaptor supplied or recommended in Accessories (supplied/ optional). Do not use any other AC power adaptor. It may cause a malfunction. Polarity of the plug TABLE OF CONTENTS 1. SERVICING NOTE ·························································· 3 2. GENERAL ·········································································· 6 3. DISASSEMBLY ································································ 7 3-1. Upper Lid Section ························································· 7 3-2. Cabinet (Middle) Section ·············································· 8 3-3. MAIN Board, Optical Pick-Up Section (CDM-3325ES2) ··················· 8 3-4. Motor Assy Turn Table (M902), Optical Pick-Up Assy (DAX-25E) ································ 9 4. ELECTRICAL ADJUSTMENT ·································· 10 5. DIAGRAMS ······································································ 11 5-1. Block Diagram -“ Main (1/2) Section -“ ······················· 12 5-2. Block Diagram -“ Main (2/2) Section -“ ······················· 13 5-3. Block Diagram -“ Power Supply Section -“ ·················· 14 5-4. Printed Wiring Board -“ MAIN Board (Side A) -“ ········ 15 5-5. Printed Wiring Board -“ MAIN Board (Side B), SUB Board -“ ······················· 16 5-6. Schematic Diagram -“ MAIN Board (1/3) -“ ················ 17 5-7. Schematic Diagram -“ MAIN Board (2/3) -“ ················ 18 5-8. Schematic Diagram -“ MAIN Board (3/3) -“ ················ 19 5-9. IC Block Diagram ······················································· 20 5-10. IC Pin Function Description ········································ 21 6. EXPLODED VIEWS ······················································ 23 7. ELECTRICAL PARTS LIST ······································· 26 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Ver 1.1 2002.12 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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3 D-EJ2000 SECTION 1 SERVICING NOTE The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.BEFORE REPLACING THE OPTICAL PICK-UP BLOCK Please be sure to check thoroughly the parameters as par the Optical Pick-Up Block Checking Procedures (Part No.: 9-960-027-11) issued separately before replacing the optical pick-up block. Note and specifications required to check are given below. -FOK output: IC601 yg pin When checking FOK, remove the lead wire to disc motor. -RF signal P-to-P value: 0.34 to 0.74 Vp-p LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S804. (push switch type) The following checking method for the laser diode is operable. -Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S804 with a screwdriver having a thin tip as shown in Fig.1. 3. Press theubutton. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 4 times along with inward motion for the focus search. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT Fig. 1 Method to push the S804 detection lever detection lever MAIN board S804