Sony d ej 011 service manual

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2 D-EJ011 Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL ................................................................... 3 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 4 3-2. Cabinet (Inner) Assy, Cabinet (Lower) Assy ...................................................... 4 3-3. Optical Pick-up (CDM-3525A), MAIN Board .................................................................... 5 4. ELECTRICAL ADJUSTMENT ............................. 6 5. DIAGRAMS 5-1. Block Diagram ................................................................ 8 5-2. Printed Wiring Board -“ Main Board (Side A) -“ ................................................. 9 5-3. Printed Wiring Board -“ Main Board (Side B), Jack Board -“ ............................. 10 5-4. Schematic Diagram -“ Main Board (1/2) -“ ..................... 11 5-5. Schematic Diagram -“ Main Board (2/2), Jack Board -“ . 12 5-6. IC Pin Function Description ............................................ 15 6. EXPLODED VIEWS ................................................. 17 7. ELECTRICAL PARTS LIST .................................. 18 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

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3 D-EJ011 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S811. (push switch type) The following checking method for the laser diode is operable. Fig. 1 Method to push the S811 SECTION 2 GENERAL This section is extracted from instruction manual. LOCATING THE CONTROLS -Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S811 with a screwdriver having a thin tip as shown in Fig.1. 3. Press the u button. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pick-up is faulty. In this operation, the objective lens will move up and down 2 times along with inward motion for the focus search. S811 Remaining battery power Sound mode Track number Playing time Play mode Bookmark * The button has a tactile dot. ��^ *(play/pause) DC IN 4.5 V 2 (headphones) jack ��p(stop) HOLD (rear) VOL -“/+* Headphones SOUND/AVLS =+ /� P MODE/ OPEN Display