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Extracted text from sony cdx m 30 service manual (Ocr-read)
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CDX-M30
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
T he laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
T he flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
-N ever reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be damaged
by heat.
TEST DISCS
Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01) If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.
SERVICE NOTES
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Power requirements 12 V DC boat battery (negative ground (earth))
Dimensions Approx. 178 × 50 × 180 mm
(7
1/8 × 2 × 7 1/8 in.) (w/h/d)
Mounting dimensions Approx. 182 × 53 × 162 mm
(7
1/4 × 2 1/8 × 6 1/2 in.) (w/h/d)
Mass Approx. 1.2 kg (2 lb. 11 oz.)
Supplied accessories Card remote commander: RM-X151 Parts for installation and connections (1 set)
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
Design and specifications are subject to change without
notice.
optical pick-up
semi-fixed resistor
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CDX-M30
-UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
-
CD Playback
You can play CD-DA (also containing CD TEXT) and CD-R/
CD-RW (MP3/WMA/AAC files).
T ype of discs Label on the disc
CD-DA
MP3
WMA
AAC
T ABLE OF CONTENTS
1. SERVICE NOTE
........................................................ 4
2. GENERAL
Location of controls and basic operations ....................... 5
Connections ..................................................................... 5
3. DISASSEMBLY
3-1. Sub (AUX) Panel Assy .................................................... 8
3 -2. CD Mechanism Block ..................................................... 8
3-3. MAIN Board .................................................................... 9
3-4. SERVO Board .................................................................. 9
3-5. Chassis (T) Sub Assy ....................................................... 10
3 -6. Roller Arm Assy .............................................................. 10
3-7. Chassis (OP) Assy ........................................................... 11
3-8. Chucking Arm Sub Assy ................................................. 11
3-9. Sled Motor Assy .............................................................. 12
3-10. Optical Pick-up Section ................................................... 13
3-11. Optical Pick-up ................................................................ 13
4. DIAGNOSIS FUNCTION ........................................ 14
5. DIAGRAMS
5-1. Block Diagram -“Main Section-“ ...................................... 17
5-2. Block Diagram -“Display Section-“ .................................. 18
5-3. Printed Wiring Board -“Main Section-“ ............................ 19
5-4. Schematic Diagram -“Main Section (1/3)-“ ...................... 20
5-5. Schematic Diagram -“Main Section (2/3)-“ ...................... 21
5-6. Schematic Diagram -“Main Section (3/3)-“ ...................... 22
5-7. Printed Wiring Board -“Sub Section-“ .............................. 23
5-8. Schematic Diagram -“Sub Section-“ ................................. 23
5-9. Printed Wiring Board -“Display Section-“ ........................ 24
5-10. Schematic Diagram -“Display Section-“ ........................... 25
6. EXPLODED VIEWS
6-1. Main Section .................................................................... 29
6-2. Front Panel Section ......................................................... 30
6 -3. CD Mechanism Section (MG-101FC-188//Q) ................ 31
7. ELECTRICAL PARTS LIST .................................. 32