Sony cdx m 10 service manual

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sony cdx m 10 service manual

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2 CDX-M10/MR10 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT T he laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick- up block. SERVICE NOTES CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Po wer amplifier section Outputs Speaker outputs (sure seal connectors) Speaker impedance 4 -“ 8 ohms Maximum power output 52 W × 4 (at 4 ohms) General Output Audio outputs terminal (rear/sub switchable) Power antenna (aerial) relay control terminal Power amplifier control terminal Inputs Telephone ATT control terminal (CDX-MR10) Remote controller input terminal Antenna (aerial) input terminal A UX input jack (stereo mini jack) T one controls Low: ±10 dB at 60 Hz (XPLOD) Mid: ±10 dB at 1 kHz (XPLOD) High: ±10 dB at 10 kHz (XPLOD) Power requirements 12 V DC boat battery (negative ground (earth)) Dimensions Approx. 178 × 50 × 179 mm (7 1/8 × 2 × 7 1/8 in.) (w/h/d) Mounting dimensions Approx. 182 × 53 × 162 mm (7 1/4 × 2 1/8 × 6 1/2 in.) (w/h/d) Mass Approx. 1.2 kg (2 lb. 11 oz.) Supplied accessories Parts for installation and connections (1 set) AUX cap Design and specifications are subject to change without notice. Notes on Chip Component Replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. TEST DISCS Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01) PATD-012 (Part No. 4-225-203-01) optical pick-up semi-fixed resistor

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3 CDX-M10/MR10 -CD Playback You can play CD-DA (also containing CD TEXT) and CD-R/ CD-RW (MP3/WMA files). T ype of discs Label on the disc CD-DA MP3 WMA T ABLE OF CONTENTS 1. SERVICE NOTE ....................................................... 4 2. GENERAL Location of Controls ........................................................ 5 Connections ..................................................................... 5 3. DISASSEMBLY 3-1. Sub Panel Assy ................................................................ 9 3 -2. CD Mechanism Block ..................................................... 9 3-3. Main Board ...................................................................... 10 3-4. Servo Board ..................................................................... 10 3-5. Chassis (T) Sub Assy ....................................................... 11 3 -6. Roller Arm Assy .............................................................. 11 3-7. Chassis (OP) Assy ........................................................... 12 3-8. Chucking Arm Sub Assy ................................................. 12 3-9. Sled Motor Assy .............................................................. 13 3-10. Optical Pick-up Section ................................................... 14 3-11. Optical Pick-up ................................................................ 14 4. DIAGNOSIS FUNCTION ....................................... 15 5. DIAGRAMS 5-1. Block Diagram -“Main Section-“ ...................................... 17 5-2. Block Diagram -“Display Section-“ .................................. 18 5-3. Printed Wiring Board -“Main Section-“ ............................ 19 5-4. Schematic Diagram -“Main Section (1/4)-“ ...................... 20 5-5. Schematic Diagram -“Main Section (2/4)-“ ...................... 21 5-6. Schematic Diagram -“Main Section (3/4)-“ ...................... 22 5-7. Schematic Diagram -“Main Section (4/4)-“ ...................... 23 5-8. Printed Wiring Board -“Key Section-“ .............................. 24 5-9. Schematic Diagram -“Key Section-“ ................................. 25 6. EXPLODED VIEWS 6-1. Main Section .................................................................... 29 6 -2. Front Panel Section ......................................................... 30 6 -3. CD Mechanism Section (MG-101TC-188//Q) ................ 31 7. ELECTRICAL PARTS LIST ................................ 32 This label is located on the bottom of the chassis. This compact disc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the e xterior. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ËšC higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ËšC. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.