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Extracted text from sony cdx hr 70 ms service manual (Ocr-read)
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CDX-HR70MS/HR70MW/HS70MS/HS70MW
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
T he laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
T he flexible board is easily damaged and should be handled with
care. If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.
SERVICE NOTES
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Po
wer amplifier section
Outputs Speaker outputs (sure seal connectors)
Speaker impedance 4 -“ 8 ohms
Maximum power output 52 W × 4 (at 4 ohms)
General
Outputs Audio outputs terminal (front, sub/rear switchable)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Inputs Telephone ATT control terminal Illumination control terminal
BUS control input terminal
B US audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
A UX input terminal
T one controls Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements 12 V DC boat battery (negative ground (earth))
Dimensions Approx. 197 × 89 × 187 mm
(7
7/8 × 3 5/8 × 7 3/8 in.) (w/h/d)
Mounting dimensions Approx. 181 × 52 × 144 mm
(7
1/4 × 2 1/8 × 5 3/4 in.) (w/h/d)
Mass Approx. 1.7 kg (3 lb. 12 oz.)
Supplied accessories Card remote commander: RM-X151 Parts for installation and connections (1 set)
Design and specifications are subject to change without
notice.
US and foreign patents licensed from Dolby Laboratories.
optical pick-up
semi-fixed resistor
A TTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
D ANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be damaged
by heat.
TEST DISCS
Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
This label is located on the bottom of the chassis.
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CDX-HR70MS/HR70MW/HS70MS/HS70MW
-UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
-
CD Playback
You can play CD-DA (also containing CD TEXT*) and CD-R/
CD-RW (MP3/WMA/AAC files also containing Multi Session)
and ATRAC CD (ATRAC3 and ATRAC3plus format).
T ype of discs Label on the disc
CD-DA
MP3
WMA AAC
A TRAC CD
*A CD TEXT disc is a CD-DA that includes information such as disc,
artist and track name.
T ABLE OF CONTENTS
1. SERVICE NOTE
........................................................ 4
2. GENERAL
Location of Controls ........................................................ 5
Connection Example (CDX-HS70MS/HS70MW) ......... 6
Connection Example (CDX-HR70MS/HR70MW) ......... 6
Connection (CDX-HS70MS/HS70MW) ......................... 7
Connection (CDX-HR70MS/HR70MW) ........................ 8
3. DISASSEMBLY
3-1. Front Panel Overall Assy ................................................. 9
3-2. Sub Panel Section ............................................................ 10
3-3. CD Mechanism Block ..................................................... 10
3-4. Main Board ...................................................................... 11
3-5. Servo Board ..................................................................... 11
3-6. Chassis (T) Sub Assy ....................................................... 12
3 -7. Roller Arm Assy .............................................................. 12
3-8. Chassis (OP) Assy ........................................................... 13
4. DIAGNOSIS FUNCTION ........................................ 14
5. DIAGRAMS
5-1. Block Diagram -“Main Section-“ ...................................... 17
5-2. Block Diagram -“Display Section-“ .................................. 18
5-3. Printed Wiring Board -“Main Section-“ ............................ 19
5-4. Schematic Diagram -“Main Section (1/3)-“ ...................... 20
5-5. Schematic Diagram -“Main Section (2/3)-“ ...................... 21
5-6. Schematic Diagram -“Main Section (3/3)-“ ...................... 22
5-7. Printed Wiring Board -“Sub Section-“ .............................. 23
5-8. Schematic Diagram -“Sub Section-“ ................................. 24
6. EXPLODED VIEWS
6-1. Front Panel Section ......................................................... 29
6-2. Sub Panel Section ............................................................ 30
6-3. Main Section .................................................................... 31
6-4. CD Mechanism Section (MG-101FA-188//Q) ................ 32
7. ELECTRICAL PARTS LIST .................................. 33
Ver. 1.1