Page 1
CDX-GT272
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re fl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens. This compact disc player is classi
fi ed as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
This label is located on the bottom of the chassis.
- CD playback You can play CD-DA (also containing CD TEXT), CD-R/CD-
RW (MP3/WMA fi les).
Type of discs Label on the disc
CD-DA
MP3
WMA
CAUTION
Use of controls or adjustments or performance of procedures other than
those speci fi ed herein may result in hazardous radiation exposure.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi- fi xed resistor located at the side of optical
pick-up block. TEST DISCS
Please use the following test discs for the check on the CD section.
YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
optical pick-up
semi-fixed resistor
Page 2
CDX-GT272
3
SECTION 1
SERVICE NOTE
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
- Connect the MAIN board (CNP301) and the SERVO board (CN2) with the extension cable (Part No. J-2502-076-1).
SERVO BOARD
CN2
MAIN BOARD
CNP301
J-2502-076-1
1. SERVICE NOTE ..................................................... 3
2. GENERAL
Location of Controls ....................................................... 5
Connections .................................................................... 5
3. DISASSEMBLY
3-1. Sub Panel Assy ............................................................... 8
3-2. CD Mechanism Block ..................................................... 8
3-3. Main Board ..................................................................... 9
3-4. Servo Board .................................................................... 9
3-5. Chassis (T) Sub Assy ...................................................... 10
3-6. Roller Arm Assy .............................................................. 10
3-7. Chassis (OP) Assy ........................................................... 11
3-8. Chucking Arm Sub Assy ................................................. 11
3-9. Sled Motor Assy .............................................................. 12
3-10. Optical Pick-up Section .................................................. 13
3-11. Optical Pick-up ............................................................... 13
4. DIAGNOSIS FUNCTION
..................................... 14TABLE OF CONTENTS
5. DIAGRAMS
5-1. Block Diagram -Main Section- ..................................... 17
5-2. Block Diagram -Display Section- ................................. 18
5-3. Printed Wiring Board -Main Section- ............................ 19
5-4. Schematic Diagram -Main Section (1/4)- ...................... 20
5-5. Schematic Diagram -Main Section (2/4)- ...................... 21
5-6. Schematic Diagram -Main Section (3/4)- ...................... 22
5-7. Schematic Diagram -Main Section (4/4)- ...................... 23
5-8. Printed Wiring Boards -Key Section- ............................ 24
5-9. Schematic Diagram -Key Section- ................................ 25
6. EXPLODED VIEWS
6-1. Main Section ................................................................... 29
6-2. Front Panel Section ......................................................... 30
6-3. CD Mechanism Section (MG-101TC-188//C) ............... 31
7. ELECTRICAL PARTS LIST .............................. 32
