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Extracted text from sony cdx 715 service manual (Ocr-read)
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The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
¥ Material: GaAlAs
¥ Wavelength: 780 nm
¥ Emission Duration: continuous
¥ Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
Flexible Circuit Board Repairing
¥ Keep the temperature of the soldering iron around 270 ûC dur-
ing repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1. SERVICE NOTE
........................................................ 2
2. GENERAL
Installation ....................................................................... 5
Connections ..................................................................... 6
3. DISASSEMBLY ......................................................... 8
4. MECHANISMDECK ASSEMBLY ...................... 14
5. MECHANICAL ADJUSTMENTS ....................... 18
6. ELECTRICAL ADJUSTMENTS ......................... 19
7. DIAGRAMS
7-1. Block Diagram
Ð SERVO Section Ð ......................................................... 21
Ð MAIN Section Ð ........................................................... 23
7-2. Printed Wiring Boards Ð RF Section Ð .......................... 25
7-3. Schematic Diagram Ð RF Section Ð ................................ 27
7-4. Printed Wiring Board
Ð MAIN Section Ð MAIN Board (Component side) ...... 29
Ð MAIN Section Ð MAIN Board (Conductor side) ........ 31
7-5. Schematic Diagram
Ð MAIN Section Ð MAIN Board (1/2) ........................... 33
Ð MAIN Section Ð MAIN Board (2/2) ........................... 35
7-6. Printed Wiring Board Ð JACK Section Ð ....................... 37
7-7. Schematic Diagram Ð JACK Section Ð ........................... 38
7-8. IC Pin Function Description ........................................... 45
8. EXPLODED VIEWS ................................................ 47
9. ELECTRICAL PARTS LIST ............................... 52
ATTENTION AU COMPOSANT AYANT RAPPORT
Ë LA SƒCURITƒ!
LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE !
SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE
DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIéCES SONY DONT LES
NUMƒROS SONT DONNƒS DANS CE MANUEL OU
DANS LES SUPPLƒMENTS PUBLIƒS PAR SONY.SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
SECTION 1
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
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DISC MAGAZINE GETTING OUT PROCEDURE ON
THE POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) assÕy to arrow direction.
2) Removal the magazine assÕy.
Note:Take out the magazine only when the tray is completely within the
magazine. If the disc or tray is sticking out, turn on the power and
eject the magazine.
Lever (stop) assy
Magazine assy