Sony cdx 545 xrf service manual

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2 ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL Location and Function of Controls ................................. 4 Operation ......................................................................... 6 Installation ....................................................................... 8 Connections ..................................................................... 9 3. DISASSEMBLY ......................................................... 10 4. MECHANISM DECK ASSEMBLY ................... 16 5. MECHANICAL ADJUSTMENT .......................... 18 6. ELECTRICAL CHECK .......................................... 19 7. DIAGRAMS 7-1. Block Diagram -“ SERVO Section -“ .............................. 21 7-2. Block Diagram -“ MAIN Section -“ ................................ 22 7-3. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 23 7-4. Printed Wiring Boards -“ RF/LSW Boards -“ ................. 24 7-5. Schematic Diagram -“ RF/LSW Boards -“ ...................... 25 7-6. Printed Wiring Boards -“ MAIN Board (Component Side) -“ .............................. 26 7-7. Printed Wiring Boards -“ MAIN (Conductor Side)/SW Boards -“ ....................... 27 7-8. Schematic Diagram -“ MAIN Board (1/2) -“ .................. 28 7-9. Schematic Diagram -“ MAIN (2/2)/SW Boards -“ ......... 29 7-10. Printed Wiring Boards -“ FM Board -“ ............................ 30 7-11. Schematic Diagram -“ FM Board -“ ................................. 31 7-12. IC Pin Function Description ........................................... 35 8. EXPLODED VIEWS ................................................ 37 9. ELECTRICAL PARTS LIST ............................... 43Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.