Sony cdx 530 rf service manual

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2 ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL Location and Function of controls .................................. 4 Installation ....................................................................... 10 Connections ..................................................................... 11 3. DISASSEMBLY ......................................................... 13 4. MECHANISM DECK ASSEMBLY .................... 19 5. MECHANICAL ADJUSTMENT .......................... 21 6. ELECTRICAL CHECK .......................................... 22 7. DIAGRAMS 7-1. Block Diagram -“ RF SERVO Section -“ ........................ 23 7-2. Block Diagram -“ MAIN Section -“ ................................ 24 7-3. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 25 7-4. Printed Wiring Boards -“ RF Section -“ .......................... 26 7-5. Schematic Diagram -“ RF Section -“ ............................... 27 7-6. Printed Wiring Boards -“ MAIN Section (1/2) -“ ........... 28 7-7. Printed Wiring Boards -“ MAIN Section (2/2) -“ ........... 29 7-8. Schematic Diagram -“ MAIN Section (1/2) -“ ................ 30 7-9. Schematic Diagram -“ MAIN Section (2/2) -“ ................ 31 7-10. Printed Wiring Boards -“ FM/POWER Section -“ .......... 32 7-11. Schematic Diagram -“ FM/POWER Section -“ ................ 33 7-12. IC Pin Function Description ........................................... 34 8. EXPLODED VIEWS ................................................ 40 9. ELECTRICAL PARTS LIST ............................... 46

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3 SECTION 1 SERVICING NOTES DISC MAGAZINE GETTING OUT PROCEDURE ON THE POWER SUPPLY IS OFF Remove the COVER (LOWER.T) assy beforehand 1) Press the lever (ML.S) to arrow direction. 2) Removal the magazine assy. Note: Take out the magazine only when the tray is completely within the magazine. If the disk or tray is sticking out, turn on the power and eject the magazine. NOTES ON HANDLING THE OPTICAL PICK- UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. Laser Diode Properties - Material: GaAlAs - Wavelength: 780 nm - Emission Duration: continuous - Laser Output Power: less than 44.6 µW* * This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Lever (ML.S) Magazine assy