Sony cdx 52 service manual

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sony cdx 52 service manual

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Page 1

_ +__CDX-52/_52RF_

SERVICE MANUAL us Model

Canadian Model A
E Model

CDX-52/52RF
AEP Model
UK Model

CDX-52FlF

Photo: COX-52

Model Name Using Similar Mechanism CDX-51/51RF
CD Drive Mechanism Type MG-1 10A-132
Optical Pick-Up Name KSS-410A
SPECIFICATIONS
CD changer Hideaway unit 1 Wired remote (RM-X51) I Supplied accessories
System Compact disc digital audio WifEIESS remue (RM'XSB) (CDX'SZHF) Disc magazine (1)
System Frequency mam/88.5mmam/ BUS Cable I1)
Laser Diode Properties Material: GaAlAs 88.9M1-iz/89JMi-lz/893tvfl-iz/ RCA Pin cord (1)
Wavelength: 780nm s95wfl-iz/s97ivfl-iz/899i/fl-iz/ M°¥$ ha'dwae 5)
Emission Duration: Continuous (switchable) LIIhIm battery (CRZOE) (II
Laser out-put Power: [less than Dimensions Hideaway unit: (CDX-SZHF)
44.6 uW Approx. 125.2x3l.6 x 128.2 mm Design and specifications subject to change without
' This output is the value (5x 1 /.x5 '/5 in.) (W/h/d) notice.
measured at a distance of 200 mm Wired remote:
from the objective lens surface on Approx. 148 x30 x l5 mm
the Optical Pick-up Block. (5 f/I X 1 3/is x "/32 in) (w/h/d)
Frequency response 10 - 20,000 Hz ereless remote:
Wow and flutter Below than the measurable limit Agproxs38AX S" X 344"
Signal-to-noise ratio More than 90 dB M Ill'd/m x A 3 _ /' "I (w/h/d)
Output terminals BUS control output terminal ass ' eaway unit.
(a Pin) sign 450 5 (153 02.)
Analog audio output terminal A " remote
. pprox. 120 g (4.2 oz.)
(RCA Pm) Wireless remote:
Current drain 800 mA (at playback) Approx 20 g (0 7 oz)
800 mA (at disc loading / I ' I
ejecting)
Operating temperature

-10°C to +55C (14°F to 131°F)

Dimensions Approx. 305 x 90 x 180 mm
(lZ/sx35/ix7/n in.) (w/h/d) cDX'52

l COMPACT DISC CHANGER
cnx-sznr

COMPACT DISC CHANGER SYSTEM
ONY;

Page 2

TABLE OF CONTENTS

1 . GENERAL

Installation ........................ 3
Connections 4
Location and Function of Controls ~ - 6

2. DISASSEMBLY ......................... 7

,3- MECHANICAL ADJUSTMENT ~~~~~~~~~~ ll

4. ELECTRICAL ADJUSTMENTS ~~~~~~~~~~ 12

5. DIAGRAMS

5-l. Compact Disc Changer Section

Printed Wiring Boards (CDX-SZ, CDX-SZRF;

AEP, UK, German, E, Taiwan) ~~~~~~~~~~~~~ 20
5-2. , Compact Disc Changer Section

Schematic Diagram (CDX-SZ, CDX-SZRF:

AEP, UK, German, E, Taiwan) ~~~~~~~~~~~~~ 23
5.3. Compact Disc Changer Section

Schematic Diagram (CDX-SZRF: US,

Canadian) ............................... 29
5-4. Compact Disc Changer Section

Printed Wiring Boards (CDX-SZRF: US,

Canadian) ............................... 33
5-5. Hideaway Section Printed Wiring Board ~ ~ 36

5-6. Hideaway Section Schematic Diagram 37
5-7. IC Pin Function Description ---------------- 39
6. EXPLODED VIEWS .................... 46
7. ELECTRICAL PARTS LIST ----------- 53

SAFETY-RE LA'I'ED COMPONENT WARNING

COMPONENTS IDEN11FIED BY MARK A OR DOTI'ED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic load, etc. on clothing
and the human body.

During repair, pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is
included in the repair parts.

The flexible board is easily damaged and should be handled
with care.

Laser Diodc Properties

0 Material: GaAlAs

o Wavelength: 780 nm

0 Emission Duration: continuous

0 Laser Output Power: less than 44.6 11 W"

* This output is the value measured at a distance of

200 mm from the objective lens surfase on the
Optical Pick-up Block,

CAUTION

Use of'controls or adjustments or performance
of procedures other than those specified herein
may result in hazardous radiation exposure.

Flexlble Clrcult IBoard Repalrlng

0 Keep the temperature of the soldering iron around
270°C during repairing.

0 Do not touch the soldering iron on the same conductor
of the circuit board (within 3 times).

0 Be careful not to apply force on the conductor when
soldering or unsoldering.

Notes on chip component replacement

0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may
be damaged by heat.

Arrermou AIJ cOMPOSANT AYANT RAPPORT
A LA SEOURITEI

Les COMPOSANTS roennrrés PAR UNE MAnoue A
sun Les DIAGRAMMES scHeMAnoues e1- LA usre
Des PIECES sorrr camoues POUR LA secunrre
DE Foncnonnemeu-r. NE REMPLACER ces oom-
POSANTS oue PAR DES PIECES sonv DONT Les
NUMEROS sour Domes DANS ce MANUEL ou
DANS Les SUPPLEMENTS Pueués PAR sonv.