Sony cdx 454 xrf service manual

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2 CDX-454RF/454XRF TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL Location of controls ........................................................ 4 Installation ....................................................................... 5 Connections ..................................................................... 7 3. DISASSEMBLY 3-1. Disassembly Flow .......................................................... 8 3-2. Case (Upper. T), Front Panel Assy ................................. 9 3-3. Mechanism Deck (MG-251A-137) ................................ 9 3-4. FM Board ........................................................................ 10 3-5. MAIN Board, Slide Variable Resistor (Elevator Height Sensor) (RV202) ................................. 10 3-6. ELJ Motor Assy (Elevator) (M104) ................................ 11 3-7. Escutcheon (T) ................................................................ 11 3-8. Chassis (U.S) Sub Assy .................................................. 12 3-9. Chassis assy ..................................................................... 12 3-10. RF Board ......................................................................... 13 3-11. Sled Motor Assy (251) (M101), Optical Pick-up (KSS-720A) .......................................... 13 3-12. LSW Board, Spindle Motor (S) Sub Assy (M102) ........ 14 3-13. ELJ Motor Assy (Chucking) (M103) ............................. 14 4. ASSEMBLY 4-1. Assembly Flow ................................................................ 15 4-2. Optical Pick-up Complete Assy ...................................... 15 4-3. Gear (Lomini)/(Load 1) Assy ......................................... 16 4-4. Operation Check ............................................................. 16 5. MECHANICAL ADJUSTMENTS ....................... 17 6. ELECTRICAL CHECK .......................................... 18 7. DIAGRAMS 7-1. Block Diagram -“ SERVO Section -“ .............................. 21 7-2. Block Diagram -“ MAIN Section -“ ................................ 22 7-3. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 23 7-4. Printed Wiring Boards -“ RF/LSW Boards -“ ................. 24 7-5. Schematic Diagram -“ RF/LSW Boards -“ ...................... 25 7-6. Printed Wiring Board -“ MAIN Board (Component Side) -“ .............................. 26 7-7. Printed Wiring Boards -“ MAIN (Conductor Side)/SW Boards -“ ....................... 27 7-8. Schematic Diagram -“ MAIN Board (1/2) -“ .................. 28 7-9. Schematic Diagram -“ MAIN (2/2)/SW Boards -“ ......... 29 7-10. Printed Wiring Board -“ FM Board -“ ............................. 30 7-11. Schematic Diagram -“ FM Board -“ ................................. 31 7-12. IC Pin Function Description ........................................... 36 8. EXPLODED VIEWS 8-1. General Section-1 ............................................................ 38 8-2. General Section-2 ............................................................ 39 8-3. Mechanism Deck Section-1 (MG-251A-137) ................ 40 8-4. Mechanism Deck Section-2 (MG-251A-137) ................ 41 8-5. Mechanism Deck Section-3 (MG-251A-137) ................ 42 8-6. Mechanism Deck Section-4 (MG-251A-137) ................ 43 9. ELECTRICAL PARTS LIST ............................... 44 ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. OPTICA L PICK-UP BLOCK SEMI-FIXED RESISTOR US/Canadian model: If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block.

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3 CDX-454RF/454XRF SECTION 1 SERVICING NOTES DISC MAGAZINE GETTING OUT PROCEDURE ON THE POWER SUPPLY IS OFF Remove the COVER (LOWER.T) assy beforehand 1) Press the lever (ML.S) to arrow direction. 2) Removal the magazine assy. Note: Ta ke out the magazine only when the tray is completely within the magazine. If the disk or tray is sticking out, turn on the power and eject the magazine. NOTES ON HANDLING THE OPTICAL PICK- UP BLOCK OR BASE UNIT Lever (ML.S) Magazine assy T he laser diode in the optical pick-up block may suffer electro- static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. TEST DISC T his set can playback a CD-R, CD-RW for audio use. When test this set, use the following test disc. T est disc for CD-R: TCD-R082LMT (Part No.: J-2502-063-1) Notes on CD-R/CD-RW discs Y ou can play CD-Rs (recordable CDs) designed for audio use on this unit. Look for this mark to distinguish CD-Rs for audio use. This mark denotes that a disc is not for audio use. Some CD-Rs (depending on the equipment used for its recording or the condition of the disc) may not play on this unit. Y ou cannot play a CD-R that is not finalized *. Y ou cannot play CD-RWs (rewritable CDs). * A process necessary for a recorded CD-R disc to be played on the audio CD player. power supply cord (J-2502-058-2) compact disc changer RF output cord (J-2502-058-1) wirerd remote commander JIG ON REPAIRING When repairing this set, connect the jig (cord) for RF output ex- tract (Part No. J-2502-058-1) and power supply (Part No. J-2502- 058-2) as the figure shown below. V er 1.1