Sony cdx 4040 service manual

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sony cdx 4040 service manual

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CDX-404O EXCD-40

TABLE OF CONTENTS

Section Title Page


Specifications
Servicing Note --------------
SECflON 1. GENERAL

Location of Controls ................................. 4
SEC110N 2. CIRCUIT DESCRIPTION --------------------- 5
SECTION 3. MECHANICAL ADJUSTMENTS --------------- 9
sscnon 4. ELECTRICAL ADJUSTMENTS ~ ----------- 9
SECTION 5. DIAGRAMS

5.1. Block Diagram ................................. 14

5-2. Semiconductor Lead Layouts ------------------ 17

53. Printed Wiring Boards (MD Section) ~~~~~ 19

54. Schematic Diagram (MD Section)----
55. Circuit Board Location ------------------------
56. Printed Wiring Boards (MAIN Section)
5-7. Schematic Diagram (MAIN Section) - 27
58. Schematic Diagram (TUNER Unit) ------------- 31
59. IC Block Diagrams ------------------
510. Waveforms --------------------------

SECTION 6. EXPLODED VIEWS ------------------------- 37
SECTION 7. ELECTRICAL PARTS LIST ---------- ~ 43
Hardware List ~~~~~ . 52

SERVICING NOTE

1) Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around
270°C during repairing

0 Do not touch the soldering iron on the same con-
ductor of the circuit board (within 3 times)

0 Be careful not to apply force on the conductor
when soldering or unsoldering.

Notes on chip component replacement

0 Never reuse a disconnected chip component
0 Notice that the minus side of a tantalum capacitor
may be damaged by heat,

SAFETY-RELATED COMPONENT WARNING

COMPONENTS IDENTIFIED BV MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

2) Removing the Flat Package IC

1. Prepare an enameled wire (0.3mm diameter) and
apply it to the back side of the 10 pins as illus-
trated below.

Solder or fix with adhesive tape.

2. Heat the IC pin with the soldering iron and draw

the enameled wire so that the IC pin is removed
from the pattern as illustrated.