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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 3
Getting Started ......................................................................... 3
Setting the clock ...................................................................... 3
CD Player ................................................................................ 3
Radio ....................................................................................... 4
Other Functions ....................................................................... 5
Connections ............................................................................. 6
2. DISASSEMBLY
2-1. Sub Panel (CD) Assy ........................................................... 8
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 9
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T) Sub Assy ........................................................ 10
2-6. Lever Section ..................................................................... 10
2-7. Servo Board ....................................................................... 11
2-8. Shaft Roller Assy .............................................................. 11
2-9. Floating Block Assy .......................................................... 12
2-10. Optical Pick-up Block ....................................................... 12
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 13
3-2. Block Diagram -“CD Section-“ ........................................... 19
3-3. Block Diagram -“Tuner Section-“ ....................................... 20
3-4. Block Diagram -“Display Section-“ .................................... 21
3-5. Circuit Boards Location .................................................... 21
3-6. Printed Wiring Boards -“CD Mechanism Section-“ ............ 22
3-7. Schematic Diagram -“CD Mechanism Section (1/2)-“ ....... 24
3-8. Schematic Diagram -“CD Mechanism Section (2/2)-“ ....... 25
3-9. Schematic Diagram -“Main Section (1/2)-“ ........................ 26
3-10. Schematic Diagram -“Main Section (2/2)-“ ........................ 27
3-11. Printed Wiring Board -“Main Section-“ .............................. 28
3-12. Printed Wiring Board -“Relay Section-“ ............................. 29
3-13. Schematic Diagram -“Relay Section-“ ................................ 30
3-14. Schematic Diagram -“Display Section-“ ............................. 31
3-15. Printed Wiring Board -“Display Section-“ .......................... 32
3-16. IC Block Diagrams ............................................................ 33
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 36
4-2. Front Panel Section ........................................................... 37
4-3. CD Mechanism Section (1) ............................................... 38
4-4. CD Mechanism Section (2) ............................................... 39
4-5. CD Mechanism Section (3) ............................................... 40
5. ELECTRICAL PARTS LIST ........................................ 41
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. General
Outputs Audio outputs
Power antenna relay
control lead
Power amplifier control
lead
Telephone ATT control
lead
Tone controls Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Power requirements 12 V DC car battery
(negative ground)
Dimensions Approx. 178 × 50 × 183 mm
(7
1/8 × 2 × 7 1/4 in.)
(w/h/d)
Mounting dimensions Approx. 182 × 53 × 162 mm
(7
1/4 × 2 1/8 × 6 1/2 in.)
(w/h/d)
Mass Approx. 1.2 kg (2 lb. 10 oz.)
Supplied accessories Parts for installation and
connections (1 set)
Front panel case (1)
Design and specifications are subject to change without
notice.
Ver 1.1 2000. 08
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
optical pick-up bloc k
semi-fixed resistor
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
