Sony CDP XA5 ES Service Manual

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CDP-XASES

SERVICE MANUAL AEP Model

Photo 2 Black

Model Name Using Similar Mechanism NEW
. CDM32MB-12M (BLACK)
CD Mecmmsm Type CDM32MN-12M (GOLD)
Base Unit Type BUv12M
Optical Pick-up Type KSS-273A
SPECIFICATIONS

Compact disc player General

Laser Semiconductor laser Power requirements 220 V - 230 V AC) 50/ 60 Hz

Wavelength 780 - 790 nm .

Frequency response 2 Hz to 20 kHz 4: 0.3 dB Power consumption 20 W

Dynamic range More than 100 dB Dimenslons (approx) 430 x 125 x 370 mm

Harmonic distortion Less than 0,0017% (W/hd) (17 X 5 x M 5/8 m') ind Pmedmg

parts
OUPUS Mass (approx.) 135 kg (29 lbs 12 02)
Jack Maximum Laad Supplied accessories
type ouxput impedance
Ievei Audio cord (2 phono plugs - 2 phone plugs) (I)
Remote commander (remote) (1)

LINE OUT Phone 2 V Over 10 kilohms Sony SUM~3 (NS) batteries (2)

(FIXED) jacks (at 50 kilohms) Stabilizer (1)

LINE OUT Phone 2 V Over 50 kilohms Design and specifications are subject to change without notice.

(VARIABLE) jacks (at 50 kilohms)

DIGITAL Optical -13 dBm Wave length: 660 nm

OUT output

(OPYICAL) connector

DIGITAL Coaxial 0.5vpxp 75 ohms

OUT outpm (75 ohms)

(COAXIAL) connector

PHONES Stereo 28 mW 32 ohms

COMPACT msc PLAYER
ONE

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CLASS I LASER PRODUCT
LUOKAN 1 LASERLAITE

KLASS 1 LASERAPPAFIAT

This appliance is classified as 3 CLASS 1
LASER product.

The CLASS 1 LASER PRODUCT
MARKING is located on the rear
exterior.

The following caution label is located
inside the unit

cumou :
ADVARSEL *

vmoi
um
WARSEL .

CAUTION

Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.

MODEL IDENTIFICATION
- BACK PANEL -
4-969-828--
L_._I I l
AEP Model : 1E1 (CED)
German Model : 2D (CEE)

SAFETY-RELATED COMPONENT WARNING I!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED

LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE

OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

TABLE OF CONTENTS

Section IitLe Bags
1. SERVICING NOTE ................................................. 3
2. GENERAL .. 4
3 DISASSEMBLY
3-1. Loading Panel ....................... . 5
3-2. Front Panel Assembly . 6
3-3. Panel (L), (R). (MD) . s
4. ELECTRICAL BLOCK ADJUSTMENTS i 7
5. DIAGRAMS
5-1. 16 Pin Functions
- IC201 System Control (CXP84124-0250) . . 9
- Main Ports .11
5-2 Circuit Boards Locatio . 12
5-3. Block Diagram..,......i... .13
5-4. Semiconductor Lead Layouts 16
5-5. Printed Wiring Board - Servo Section 17
5-6. Schematic Diagram -- Servo Section - 19
57. Printed Wiring Board - Main Section -
5-8. Schematic Diagram - Main Section -
5-9. Printed Wiring Board - Panel Sectlon
5-10. Schematic Diagram -- Panel Section -
6. EXPLODED VIEWS
6-1 Loading Panel Section
6-2. Front Panel Section .
6-3. Chassis Section
6-4l CD Mechanism Section 1
(CDM32MN»12M/CDM32MB-12M) .................................. 40
6-5. CD Mechanism Section 2
(CDMSZMN-i2M/CDM32MB~12M)
6-6. Base Unit Section (BU-12M) ........
7. ELECTRICAL PARTS LIST

Notes on chip component replacement

0

0

Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

.

.

Keep the temperature of the soldering iron around 270 °C
during repairing.

Do not touch the soldering iron on the same conductor ofthe
circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering
or unsolderingi