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Extracted text from Sony CDP CX350 Service Manual (Ocr-read)
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CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
The following
caution label is
located inside of
the unit.
PARTS No. MODEL MODEL IDENTIFICATION
Ñ BACK PANEL Ñ
4-215-964-0¹
4-215-964-1¹
4-215-964-2¹
4-215-964-3¹
4-215-964-4¹
4-215-964-5¹
4-215-964-7¹
CX300 : US
CX300 : CND
CX350 : US
CX350 : CND
CX350 : AEP, UK
CX350 : AUS
CX691 : US
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ë LA SƒCURITƒ!!
LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE !
SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE
DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIéCES SONY DONT LES NUMƒROS
SONT DONNƒS DANS CE MANUEL OU DANS LES
SUPPLƒMENTS PUBLIƒS PAR SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturersÕ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The ÒlimitÓ indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
PA R T N O .
0.15 µF To Exposed Metal
Parts on Set
1.5k W
AC
voltmeter
(0.75V)
Earth Ground
¥ Abbreviation
CND : Canadian model
AUS : Australian model
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TABLE OF CONTENTS
1. SERVICING NOTE
.......................................................... 3
2. GENERAL .......................................................................... 6
3. DISASSEMBLY
3-1. Front Panel Assembly ........................................................... 7
3-2. Table (300) Assembly ........................................................... 7
3-3. Base (Door, Gear) Assembly ................................................ 8
3-4. Pop-up Assembly .................................................................. 8
3-5. Mechanism Deck .................................................................. 9
3-6. Base Unit ............................................................................. 9
4. SERVICE MODE ............................................................. 10
5. TEST MODE ..................................................................... 14
5-1. ADJ Mode ......................................................................... 14
5-2. Key and Display Check Mode ............................................ 14
6. ADJUSTMENTS
6-1. Mechanical Adjustments ..................................................... 15
6-2. Electrical Adjustment .......................................................... 17
7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 20
7-2. Block Diagrams
¥ BD Section ........................................................................ 21
¥ Main Section ..................................................................... 23
7-3. Schematic Diagram Ð BD Section Ð ................................... 27
7-4. Printed Wiring Board Ð BD Section Ð ................................. 29
7-5. Printed Wiring Board Ð Main Section Ð .............................. 31
7-6. Schematic Diagram Ð Main (1/2) Section Ð ........................ 33
7-7. Schematic Diagram Ð Main (2/2) Section Ð ........................ 35
7-8. Printed Wiring Board Ð T. Sens Section Ð .......................... 37
7-9. Printed Wiring Board Ð T. Sens (In) Section Ð ................... 37
7-10. Printed Wiring Board Ð D. Sens (Out) Section Ð .............. 38
7-11. Schematic Diagram Ð Sensor Section Ð ............................ 38
7-12. Schematic Diagram Ð Display Section Ð ........................... 39
7-13. Printed Wiring Board Ð Display Section Ð ........................ 41
7-14. Schematic Diagram Ð Jog Section Ð .................................. 43
7-15. Printed Wiring Board Ð Jog Section Ð ............................... 44
7-16. Schematic Diagram Ð Power Section Ð ............................. 47
7-17. Printed Wiring Board Ð Power Section Ð .......................... 48
7-18. Schematic Diagram Ð Jack Section Ð ................................ 49
7-19. Printed Wiring Board Ð Jack Section Ð ............................. 50
7-20. Schematic Diagram Ð Sensor/Motor Section Ð ................. 53
7-21. Printed Wiring Board Ð Sensor/Motor Section Ð .............. 54
7-22. IC Block Diagrams ............................................................ 55
7-23. IC Pin Functions ................................................................ 58
8. EXPLODED VIEWS
8-1. Case Section ........................................................................ 60
8-2. Chassis Section ................................................................... 61
8-3. Front Panel Section ............................................................. 62
8-4. Mechanism Section 1 (CDM54-K1BD35E) ....................... 63
8-5. Mechanism Section 2 (CDM54-K1BD35E) ....................... 64
8-6. Mechanism Section 3 (CDM54-K1BD35E) ....................... 65
8-7. Opeical Pick-up Section (KSM-213BFN/M-NP) ............... 66
9. ELECTRICAL PARTS LIST ........................................ 67
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check
that the S curve waveform is output three times.