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Extracted text from Sony CDP CX240 Service Manual (Ocr-read)
Page 1
Ð 2 Ð
CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
The following
caution label is
located inside of
the unit.
PARTS No. MODEL MODEL IDENTIFICATION
Ñ BACK PANEL Ñ
4-999-020-0¹
4-999-020-1¹
US
Canadian
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ë LA SƒCURITƒ!!
LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR
LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES
PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIéCES SONY DONT LES NUMƒROS
SONT DONNƒS DANS CE MANUEL OU DANS LES
SUPPLƒMENTS PUBLIƒS PAR SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturersÕ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The ÒlimitÓ indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage .
PART NO.
0.15 µF To Exposed Metal
Parts on Set
1.5k W
AC
voltmeter
(0.75V)
Earth Ground
Page 2
Ð 3 Ð
TABLE OF CONTENTS
1. SERVICING NOTE
.......................................................... 3
2. GENERAL .......................................................................... 6
3. DISASSEMBLY
3-1. Front Panel Assembly ........................................................... 7
3-2. Back Panel Assembly ............................................................ 7
3-3. Base (Door, Gear) Assembly ................................................ 8
3-4. Table Assembly ..................................................................... 8
3-5. Mechanism Deck .................................................................. 9
3-6. Base Unit ............................................................................. 9
4. TEST MODE ..................................................................... 10
5. ADJUSTMENTS
5-1. Mechanical Adjustment ...................................................... 13
5-2. Electrical Block Checking .................................................. 19
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 22
6-2. Block Diagrams
¥ BD Section ........................................................................ 23
¥ Main Section ..................................................................... 25
6-3. Schematic Diagram Ð BD Section Ð ................................... 29
6-4. Printed Wiring Board Ð BD Section Ð ................................. 31
6-5. Printed Wiring Board Ð Main Section Ð .............................. 33
6-6. Schematic Diagram Ð Main (1/2) Section Ð ........................ 35
6-7. Schematic Diagram Ð Jack Section Ð .................................. 37
6-8. Printed Wiring Board Ð Jack Section Ð ............................... 39
6-9. Schematic Diagram Ð Display Section Ð ............................ 41
6-10. Printed Wiring Board Ð Display Section Ð ........................ 43
6-11. Schematic Diagram Ð Sensor/Motor Section Ð ................. 45
6-12. Printed Wiring Board Ð Sensor/Motor Section Ð .............. 46
6-13. IC Block Diagrams ............................................................ 47
6-14. IC Pin Functions ................................................................ 49
7. EXPLODED VIEWS
7-1. Case and Back Panel Section .............................................. 54
7-2. Disc Table Section .............................................................. 55
7-3. Front Panel Section ............................................................. 56
7-4. Mechanism Section-1 (CDM-40B) ..................................... 57
7-5. Mechanism Section-2 (CDM-40B) ..................................... 58
7-6. Mechanism Section-3 (CDM-40B) ..................................... 59
7-7. Base Unit Section (KSM-213BKN/M-N) ........................... 60
8. ELECTRICAL PARTS LIST ........................................ 61
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check
that the S curve waveform is output three times.
Page 19
Ð 20 Ð
Disc Sensor Adjustment
Perform this adjustment after completing all adjustments of the
mechanism section.
If not performed accurately, the presence of the disc may not be
detected properly.
Connection 1:
Waveform 1:
Connection 2:
Waveform 2Procedure:
1. Connect the oscilloscope to Pins 1, 2, and 4 of CN506 of the
MAIN board. Also connect a 1 kW resistor to Pin 4 at the same
time. (Connection 1)
2. Check that no discs are loaded in the unit.
3. With the power OFF, press the 1/u button while pressing the
INPUT button, and turn on the power at the same time.
4. The rotary table will continue rotating in the clockwise direction.
5. Observe the waveform at that time on the oscilloscope.
6. Loosen the screw securing the LUMINOUS board slightly.
7. Slide the LUMINOUS board to the left and right so that the
peak of the D0 waveform is at the center between the descending
point of the T1 wavefor m and ascending point of the T2
waveform. (Waveform 1) After adjusting, apply locking
compound.
8. Disconnect the resistor connected to Pin 4 of CN506 of the
MAIN board. (Connection 2)
9. Observe the waveform on the oscilloscope. (Waveform 2)
10. Adjust RV501 of the MAIN board so that the waveform on the
oscilloscope satisfies the following adjustment value 1.
11. Press the 1/u button and turn OFF the power.
12. Press the 1/u button, turn on the power, press the OPEN/
CLOSE button, and open the front cover. Next rotate the DISC/
CHARACTER dial in the counterclockwise direction
continuously so that the rotary table rotates continuously in the
counterclockwise direction.
13. Observe the waveform on the oscilloscope and confirm that it
satisfies the adjustment value 2 (waveform 3). If it does not,
adjust RV501 of the MAIN board.
Waveform 3:
CN506 of MAIN board
T1 : Pin 1 (TS. 1)
T2 : Pin 2 (TS. 2)
D0 : Pin 4 (D. SENS)oscilloscop
e
1 kW
AB
T1
T2
D
0
CN506 of MAIN board
T1 : Pin 1 (TS. 1)
T2 : Pin 2 (TS. 2)
D1 : Pin 4 (D. SENS)oscilloscope
XZ
Y
T1
T2
D1
LUMINOUS boar d
XZ
Y
T1
T2
D1