Sony CDP CE575 Service Manual

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Sony CDP CE575 Service Manual

Extracted text from Sony CDP CE575 Service Manual (Ocr-read)


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2 CDP-CE575 SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica- tion is 0.75 V, so analog meters must have an accurate low- voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suit- able. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k -„¦ 0.15 µF AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground TABLE OF CONTENTS 1. SERVICEING NOTES ............................................ 3 2. GENERAL ................................................................... 6 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 8 3-2. Case (409538) ................................................................. 9 3-3. Front Panel Section ......................................................... 9 3-4. CD Mechanism Deck (CDM59-5BD27) ........................ 10 3-5. MAIN Board ................................................................... 10 3-6. Base Unit (BU-5BD27) ................................................... 11 3-7. Table Assy ....................................................................... 11 3-8. Sensor Board ................................................................... 12 3-9. Loading Motor Board ..................................................... 12 4. ASSEMBLY ................................................................. 13 5. TEST MODE .............................................................. 14 6. ELECTRICAL ADJUSTMENTS ......................... 18 7. DIAGRAMS 7-1. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 21 7-2. Printed Wiring Board -“ BD Section -“ ........................... 22 7-3. Schematic Diagram -“ BD Section -“ .............................. 23 7-4. Printed Wiring Boards -“ MOTOR/SENSOR Section -“ ....................................... 24 7-5. Schematic Diagram -“ MOTOR/SENSOR Section -“ .... 25 7-6. Schematic Diagram -“ MAIN Section (1/2) -“ ................ 26 7-7. Schematic Diagram -“ MAIN Section (2/2) -“ ................ 27 7-8. Printed Wiring Boards -“ MAIN Section -“ .................... 28 7-9. Printed Wiring Boards -“ DISPLAY Section -“ .............. 30 7-10. Schematic Diagram -“ DISPLAY Section -“ ................... 31 7-11. IC Pin Function Description ........................................... 32 8. EXPLODED VIEWS 8-1. Case Section .................................................................... 36 8-2. Front Panel Section ......................................................... 37 8-3. Chassis Section ............................................................... 38 8-4. CD Mechanism Deck Section-1 (CDM59-5BD27) ............................................................ 39 8-5. CD Mechanism Deck Section-2 (CDM59-5BD27) ............................................................ 40 8-6. Base Unit Section (BU-5BD27) ..................................... 41 9. ELECTRICAL PARTS LIST ............................... 42 ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Ver 1.1 2001.07

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3 CDP-CE575 SECTION 1 SERVICING NOTES The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT MODEL IDENTIFICATION -“ BACK PANEL -“ Model Part No. US model 4-233-720-0s Canadian model 4-233-720-1s AEP model 4-233-720-2s HOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFF Insert a tapering driver into the aperture of the unit bottom, and turn it in the direction of the arrow (to OUT direction). table tapering driver *To close the disc table, turn the tapering driver in the reverse direction (to IN direction). Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON CLEANING OF OPTICAL PICK-UP LENS Do not clean up the optical pick-up lens.CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Carry out the S curve check in CD section adjustment and check that the S curve waveforms is output three times. LASER DIODE AND FOCUS SEARCH OPERATION CHECK This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Part No.

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6 CDP-CE575 SECTION 2 GENERAL This section is extracted from instruction manual. 4 CHECK qh (13) CLEAR qj (13, 14, 16, 17) CONTINUE 2 (9, 13, 15, 18) DISC 1-“5 3 (9, 10, 13) Disc compartment ws (9) DISC SKIP 9 (9, 12, 13) Display 4 (11) EX-CHANGE 8 (12, 15) FADER ql (14, 20) MEGA CONTROL 0 (18, 19) MENU wf (8, 16, 17)PEAK SEARCH qk (15) PHONES jack wh (10) POWER 1 (7, 9, 16) PROGRAM qd (9, 13, 18) Remote sensor wa (6) REPEAT qf (10, 18) SHUFFLE qs (9, 10, 18) TIME EDIT qg (14) TIME/TEXT w; (11) X-FADE/NO DELAY wg (19, 20) Parts Identification Front Panel The items are arranged in alphabetical order. Refer to the pages indicated in parentheses ( ) for details. Rear Panel 2ND CD IN jacks 3 (8 ) ANALOG OUT L/R jacks 4 (6 ) CONTROL A1II jacks 1 (6, 20) DIGITAL OUT OPTICAL jack 2 (7) Mains lead 5 (6) BUTTON DESCRIPTIONS A OPEN/CLOSE wj (7, 9, 10, 11) H 5 (9, 13, 15, 18, 20, 22) X 6 (10, 15, 18, 22) x 7 (10, 15, 18) lAMSL (DISC) dial qa (10, 13, 15, 17, 18, 19) m/M (AMS+/-“) wd (10, 14, 17, 18)