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Extracted text from sony cdp xe330 (Ocr-read)
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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
- Keep the temperature of soldering iron around 270ËšC
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
TABLE OF CONTENTS
MODEL IDENTIFICATION
- BACK PANEL -
Parts No.
PARTS No. MODEL
4-214-171-0
4-214-171-1
AEP, North European, CIS
UK
1. SERVICING NOTE .......................................................... 3
2. GENERAL .......................................................................... 4
3. DISASSEMBLY
3-1. Front Panel ············································································ 5
3-2. Base Unit (BU-5BD29C) ······················································ 5
4. TEST MODE ....................................................................... 6
5. ELECTRICAL BLOCK CHECKING .......................... 8
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 10
6-2. Printed Wiring Board -“ BD Section -“ ................................. 11
6-3. Schematic Diagram -“ BD Section -“ ................................... 13
6-4. Printed Wiring Board -“ Main Section -“ .............................. 15
6-5. Schematic Diagram -“ Main Section -“ ................................ 17
6-6. Printed Wiring Board -“ Display Section -“ .......................... 19
6-7. Schematic Diagram -“ Display Section -“ ............................ 21
6-8. IC Pin Functions ................................................................. 23
6-9. IC Block Diagrams ............................................................. 29
7. EXPLODED VIEWS
7-1. Main Section ....................................................................... 32
7-2. CD Mechanism Section (CDM14FL-5BD29C) ................. 33
7-3. Base Unit Section (BU-5BD29C) ....................................... 34
8. ELECTRICAL PARTS LIST ........................................ 35http://cxema.ru
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SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic load, etc. on clothing and
the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the S curve check in CD section adjustment and
check that the S curve waveform is output two times. HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and turn
in the direction of arrow.
*To close the disc table, turn the driver in the reverse direction.
Pull out disc table.http://cxema.ru