Sony cdp xe 570 service manual

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2 CDP-XE570 The following caution label is located inside of the unit. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. MODEL IDENTIFICATION - BACK PANEL - Parts No. 1. SERVICING NOTE ··························································3 2. GENERAL ··········································································6 3. DISASSEMBLY 3-1. Loading Panel·····································································7 3-2. Base Unit (BU-5BD27)······················································7 4. TEST MODE 4-1. Check Mode·······································································8 4-2. AFADJ Mode·····································································8 4-3. ADJ Mode··········································································9 5. ELECTRICAL BLOCK CHECKING ························10 6. DIAGRAMS 6-1. Circuit Boards Location···················································12 6-2. Schematic Diagram Loading Motor Section··················13 6-3. Printed Wiring Board Loading Motor Section················13 6-4. Printed Wiring Board BD Section···································14 6-5. Schematic Diagram BD Section······································15 6-6. Printed Wiring Board Main Section································16 6-7. Schematic Diagram Main Section···································17 6-8. Printed Wiring Board Display Section····························18 6-9. Schematic Diagram Display Section·······························19 6-10. IC Pinfunctions·································································20 6-11. IC Block Diagrams···························································21 7. EXPLODED VIEWS 7-1. Front Panel and Case Section···········································23 7-2. CD Mechanism Section (CDM66-5BD27)······················24 7-3. Base Unit Section (BU-5BD27)·······································25 8. ELECTRICAL PARTS LIST ·······································26 TABLE OF CONTENTS PARTS No. MODEL 4-232-150-0s 4-232-150-1s AEP UK

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3 CDP-XE570 SECTION 1 SERVICING NOTE HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF Insert a tapering driver into the aperture of the unit bottom, and turn in the direction of arrow. Use a flat (-“) head screwdriver to open the CD tray by manual opera- tion. (Flat head screwdriver with nominal blade length of 3mm.) *To close the disc table, turn the driver in the reverse direction. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Pull out disc table.