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Extracted text from sony cdp xb 720 e service manual (Ocr-read)
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SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
The following
caution label is
located inside of
the unit.
PARTS No. MODEL MODEL IDENTIFICATION
Ñ BACK PANEL Ñ
TABLE OF CONTENTS
1. SERVICING NOTE
.......................................................... 3
2. GENERAL .......................................................................... 6
3. DISASSEMBLY
3-1. Front Panel ........................................................................... 7
3-2. Base Unit (BU-5BD25) ......................................................... 7
4. TEST MODE ....................................................................... 8
5. ELECTRICAL BLOCK CHECKING ........................ 10
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 12
6-2. Printed Wiring Board Ð BD Section Ð ................................. 15
6-3. Schematic Diagram Ð BD Section Ð ................................... 17
6-4. Printed Wiring Board Ð Main Section Ð .............................. 19
6-5. Schematic Diagram Ð Main Section Ð ................................ 21
6-6. Printed Wiring Board Ð Display Section Ð .......................... 23
6-7. Schematic Diagram Ð Display Section Ð ............................ 25
6-8. Schematic Diagram Ð Power/HP Section Ð ......................... 27
6-9. Printed Wiring Board Ð Power/HP Section Ð ...................... 28
6-10. Schematic Diagram Ð Loading Motor Section Ð ............... 29
6-11. Printed Wiring Board Ð Loading Motor Section Ð ............ 29
6-12. IC Pin Functions ................................................................ 30
6-13. IC Block Diagrams ............................................................ 34
7. EXPLODED VIEWS
7-1. Case Section ........................................................................ 37
7-2. Front Panel Section ............................................................. 38
7-3. Mechanism Deck Section (CDM14FLS-5BD25) ............... 39
7-4. Base Unit Section (BU-5BD25) .......................................... 40
8. ELECTRICAL PARTS LIST ........................................ 41
4-997-214-0¹
4-997-214-1¹
XB720
XB720E
Parts No.
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SECTION 1
SERVICING NOTE
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and turn
in the direction of arrow.
*To close the disc table, turn the driver in the reverse direction.
Pull out disc table.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic load, etc. on clothing and
the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and
check that the S curve waveform is output continuously.