Page 1
2
TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 3
2. GENERAL ................................................................... 6
3. DISASSEMBLY ......................................................... 8
4. TEST MODE .............................................................. 11
5. ELECTRICAL ADJUSTMENTS ......................... 13
6. DIAGRAMS
6-1. Block Diagram Ð SERVO Section Ð .............................. 15
6-2. Block Diagram Ð MAIN Section Ð ................................ 16
6-3. Notes for Printed Wiring Board
and Schematic Diagram .................................................. 17
6-4. Printed Wiring Board
Ð SERVO Board (Component Side) Ð ............................ 18
6-5. Printed Wiring Board
Ð SERVO Board (Conductor Side) Ð .............................. 19
6-6. Schematic Diagram Ð SERVO Board (1/2) Ð ................. 20
6-7. Schematic Diagram Ð SERVO Board (2/2) Ð ................. 21
6-8. Printed Wiring Boards
Ð BSL/FL RELAY/FLEX RELAY/
LOADING MOTOR/LOADING SW Boards Ð ............. 22
6-9. Schematic Diagram
Ð BSL/FL RELAY/FLEX RELAY/
LOADING MOTOR/LOADING SW Boards Ð ............. 23
6-10. Printed Wiring Board
Ð AUDIO Board (Component Side) Ð ............................ 24
6-11. Printed Wiring Board
Ð AUDIO Board (Conductor Side) Ð .............................. 25
6-12. Schematic Diagram Ð AUDIO Board (1/2) Ð ................. 26
6-13. Schematic Diagram Ð AUDIO Board (2/2) Ð ................. 27
6-14. Printed Wiring Boards Ð COAX OUT/
D/O SW/LINE/OPT OUT/VR Boards Ð ........................ 28
6-15. Schematic Diagram Ð COAX OUT/
D/O SW/LINE/OPT OUT/VR Boards Ð ........................ 29
6-16. Printed Wiring Boards Ð KEY-L/KEY-R Boards Ð ....... 30
6-17. Schematic Diagram Ð KEY-L/KEY-R Boards Ð ........... 31
6-18. Printed Wiring Board Ð DISPLAY Board Ð .................. 32
6-19. Schematic Diagram Ð DISPLAY Board Ð ..................... 33
6-20. Printed Wiring Boards
Ð AC/POWER (Component Side)/SW Boards Ð ............ 34
6-21. Printed Wiring Board
Ð POWER Board (Conductor Side) Ð ............................. 35
6-22. Schematic Diagram Ð AC/POWER/SW Boards Ð ........ 36
6-23. IC Pin Function Description ........................................... 42
7. EXPLODED VIEWS ................................................ 48
8. ELECTRICAL PARTS LIST ............................... 55
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of the soldering iron around 270 ûC dur-
ing repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering. CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
Page 2
3
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
4-221-269-
AEP Model : 0
s
Singapore Model : 1 s
MODEL IDENTIFICATION
Ð BACK PANEL Ð
HOW TO PLAY CD WITH THE DISC TRAY
OPENED
To play a CD by this method, the screws that secure the SERVO
board to the chassis must be removed in advance.
Procedure:
1. Press
! button to turn the power ON.
2. Set a CD on the disc tray.
3. With the disc tray opened, connect pin 1 and pin 2 of CN272
on the LOADING MOTOR board using tweezers, etc.
4. As the disc starts to move toward direction A, intercept the
sensor in B section with your finger immediately. (See ÒHOW
TO OPERATE THE SET WITHOUT USING STABILIZERÓ
on page 5)
5. You can release your hand when TOC is read.
6. Hence, the operation equivalent to normal operation can be
performed.
short here
AB
