Sony cdp ex 10 service manual

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CDP-EXIU

SERVICE MANUAL AEP Model

UK Model

E Model
Australian Model
Tourist Model

This set is the CD player section in
M HC-EXS/EX7/EX9AV/EX10AVr

Model Name Using Simiier Mechanism NEW

CD Transport Mechanism Type CDM28-58019

Base Unit Type BU»SBD19

Optical Pick'Up Type KSS-21SB

SPECIFICATIONS

System Compact disc digital
audio system
Laser Semiconductor laser
Wavelength 780 - 790 nm
Frequence response
20 Hz -- 20 kHz
(:05 dB)
Signal-to-noise mlio
More than 105 dB
Dynamic range More than 95 dB
Outputs
CD OUT (phono jacks):
Output level 2 V
(at 50 kilohms)
Load impedance over
10 kilohms
CD DIGITAL OPTICAL OUT
(Square optioal Connector jack, rear
panel):
wave length 660 nm
output level ~18 (19er
Dimensions
Approx. 280 x 85 X 285 mm (w/h/d)
(11 i/8x33/8 x 11 1/4 inches)
Mass Approx. 2.0 kg (4 lb 7 07.)

Design and specifications are subject to

COMPACT Disc PLAYER
S O N'Y®

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Laser component in this product is capable oi emitting
radiation exceeding the limit tor Class 1.

This Compact Disc player is
classfied as a CLASS 1
LASER product.

The CLASS 1 LASER
product label is located on
the rear exterior.

CLASSi LASER PRODUCT
LUOKAN 1 LASERLAITE

KIASS 1 LASERAPPARAT

This caution

; INVISIBLE ussa RAD-«nor: wnEN open
label IS located

worn sxvosuns to new
mm LASERSTRAUNG van ABNING NAn
KERMEDSAFBRVDERE ER on: as FUNKIKON
a ups fiTYELsE FOR sramuo
vAROy .w AESSAJA SUOJALUKITUS OHIIETIAESSA
3 2. ALT mm usznsnmvuz
, ussnsmmnc NAR DENNA psi. an orphan
ocu svmnsn AR unxoapun

CAUTION
ADVARSEL

VARNING

ADVARSEL ; usmuc LASERSVRAUNG NAR Dense». wuss
UNNGA sxsvowsamc F05! swarm

CAUTION

Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.

Notes on chip component replacement

. Never reuse a disconnected chip component.

' Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around 270 °C
during repairing.

- Do not touch the soldering iron on the same conductor ofthe
circuit board (within 3 times).

- Be careful not to apply force on the conductor when soldering
or unsoldering.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BV MARK A OR DOTTED

LINE WITH MARK A ON THE SCHEMAIIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE

OPERATION. REPLACE THESE COMPONENTS WITH
SONV PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

inside the unit.

TABLE OF CONTENTS

53mm Idle Bags
2. ELECTRICAL ADJUSTMENTS .............................. 4
3. DIAGRAMS

3-1. l0 Pin Function
~ IC601 System Control, FL Driver (uPD76044AGF) 6

32. Block Diagram .. . B
3-3. Circuit Boards Locatio 10
341. Printed Wiring Board - Main Section - 11
3-5. Schematic Diagram - Main Section - 13
3-6. Schematic Diagram - BD Section - 16
3'7. Printed Wiring Board -- BD Section 18
3-8. Semiconductor Lead Layouts .......................................... 19

4. EXPLODED VIEWS

4-1. Chassis Section .......................................
4-2. CD Mechanism Section (CDM28-53019
4'3. Optical Pick-up Block Section (BU-53019

5. ELECTRICAL PARTS LIST .................................... 23

SERVICING NOTE

. POWER SUPPLIED WHILE SERVICING

This unit does not work independently because of not having
the power supply.

It must be unite together with the other units when repaired.