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TABLE OF CONTENTS
1. SERVICE NOTE ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááá 4
2. GENERAL ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááááááááá 7
3. DISASSEMBLY
3-1. Front Panel ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááááááááááá 9
3-2. Disc Table Assembly and Disc Table and Press Pulley áááááá 9
3-3. Main Board ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááááááááá 10
3-4. CDM Assembly ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááá 10
3-5. Optical Pick-up Block Assembly ááááááááááááááááááááááááááááááááááááá 11
3-6. Bracket (Gear) Assembly ááááááááááááááááááááááááááááááááááááááááááááááááá 11
4. TEST MODE ááááááááááááááááááááááááááááááááááááááááááááááááááá\
ááááááááááááá 12
5. ELECTRICAL BLOCK CHECKING áááááááááááááááááááá 15
6. DIAGRAMS
6-1. Circuit Boards Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\
17
6-2. Block Diagram ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááá 19
6-3. Schematic Diagram BD Section ááááááááááááááááááááááááááááááááááááá 21
6-4. Printed Wiring Board BD Section áááááááááááááááááááááááááááááááááá 23
6-5. Printed Wiring Board Main Section áááááááááááááááááááááááááááááá 25
6-6. Schematic Diagram Main Section (1/2) ááááááááááááááááááááááááá 27
6-7. Schematic Diagram Main Section (2/2) ááááááááááááááááááááááááá 29
6-8. Schematic Diagram HP Section áááááááááááááááááááááááááááááááááááá 31
6-9. Printed Wiring Board HP Section áááááááááááááááááááááááááááááááááá 32
6-10. Schematic Diagram Display Section áááááááááááááááááááááááááááááá 33
6-11. Printed Wiring Board Display Section ááááááááááááááááááááááááááá 35
6-12. IC Block Diagrams ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááá 37
6-13. IC Pin Functions ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááá 40
7. EXPLODED VIEWS
7-1. Front Panel and Case Section ááááááááááááááááááááááááááááááááááááááááááá 44
7-2. Back Panel and Disc Table Section áááááááááááááááááááááááááááááááááá 45
7-3. Chassis Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\
áááááááááááááá 46
7-4. Base Unit Section (BU-5BD22) ááááááááááááááááááááááááááááááááááááááá 47
8. ELECTRICAL PARTS LIST ááááááááááááááááááááááááááááááááááá 48
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NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT
Ë LA SƒCURITƒ!
LES COMPOSANTS IDENTIFƒS PAR UNE MARQUE ! SUR LES
DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES PIéCES SONT
CRITIQUES POUR LA SƒCURITƒ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIéSES SONY
DONT LES NUMƒROS SONT DONNƒS DANS CE MANUEL OU
DANS LES SUPPƒMENTS PUBLIƒS PAR SONY.
SAFETY CHECK-OUT
(US model only)
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturersÕ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The ÒlimitÓ indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
Earth GroundAC
voltmeter
(0.75V) 1.5k
½ 0.15 µF
Fig. A. Using an AC voltmeter to check AC leakage.
To Exposed Metal
Parts on Set
