Sony cdp c 221 service manual

Page 2

GDP-c221

Note on the Transit Key

The transit key on the bottom exterior of the unit protects
the optical system against shock during transportation.
Before operating the CD player, be sure to remove the key
by following the instructions on the label. and store it in a
safe place.

When transporting the unit, replace the key in its original
hole and lock it in place.

NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may
suffer electrostatic breakdown because of the poten-
tial difference generated by the charged electrostatic
load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-
down and also use the procedure in the printed
matter which is included in the repair parts.

The flexible board is easily damaged and should be
handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be
focused on the disc reflective surface by the objective lens in
the optical pick-up block. Therefore, when checking the laser
diode emission, observe from more than 30cm away from the
objective lens.

PROTECTION OF EYES FROM LASER BEAM DURING SERVICING

, This set employs a laser. Therefore, he sure to fol-
low carefully the instructions below when servicing.

CAUTION

Use of controls or adjustments or performance
of procedures other than those specified herein
may result in hazardous radiation exposure.

1. Laser Diode Properties

0 Material: GaAlAs
O Wavelength: 780 nm
0 Emission Duration: continuous
0 Laser Output: max. 44.6 #W
" This output is the value measured at a distance of

about 200 mm from the objective lens surface on
the Optical Pick-up Block.

2. During service, do not take the Optical Pick-up
Block apart, and do not adjust the APC circuit.
If there is a breakdown in the APC circuit (includ-
ing laser diode), replace the entire Optiocal Pick-
up Block (including APC borad).

TABLE OF CONTENTS
Section M _P_a_qg Section M Egg

1. GENEML
1-1. Location of Controls

2. DISASSEMBLV

2-1. Removal of Front Panel and Case Assemblies ------------------------- 4
2-2, Removal of Disc Tray Assembly ......................................... 4
Z»3. Removal of Optical Pick-up Block Assembly -------------------------- 4
3. ELECTRICAL BLOCK CHECKING --------------------------- 5

4. DIAGRAMS
44, Circuit Boards Location .................................................. 7
4-2. Semiconductor Lead Layouts
#3. IC Block Diagrams --------
4-4. Printed Wiring Boards -------

10
4.5. Schematic Diagram ....................................................... 15

5. EXPLODED VIEWS

5~1. Front Panel and Case Assemblies
5-2. Disc Tray Assembly
5-3. Chassis Assembly ------
5-4. Optical Pick-up Block Assembly (BU-SBD3/M) ------------------- i- 22

6. ELECTRICAL PARTS ST ..................................... 23

SAFETY-R E LATED COMPONENT WARN INGII

COMPONENTS IDENTIFIED BV MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BV SONV.

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