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WARNING!!
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF
MORE THAN 25 cm FROM THE SURFACE OF THE
OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK. CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k -„¦ 0.15 µF AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
LEAKAGE TEST
The AC leakage from any exposed metal part to earth
ground and from all exposed metal parts to any exposed metal
part having a return to chassis, must not exceed 0.5 mA (500 mi-
croamperes). Leakage current can be measured by any one of
three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica-
tion is 0.75V, so analog meters must have an accurate low-
v oltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2V AC range are suit-
ab le. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-sol-
dered connections. Check the entire board surface for solder
splashes and bridges.
2. Check the interboard wiring to ensure that no wires are
pinched or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transis- tors, that were installed during a previous repair. Point them
out to the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recom-
mend their replacement.
5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
This label is located on the laser
protective housing inside the enclosure. This appliance is classified as a
CLASS1 LASER product. The
CLASS1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the enclosure.
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T
ABLE OF CONTENTS
Section Title Page Section Title Page
SERVICE NOTE1. DISC REMOVAL PROCEDURE IF THE TRAY
CANNOT BE EJECTED (FORCED EJECTION) .......... 4
2. INSTALLATION METHOD OF EARTH SPRING (FRONT) ........................................................................\
4
3. INSTALLATION METHOD OF REAR GASKET ............ 4
4. INSTALLATION METHOD OF NON-HALOGENE TAPE ........................................................................\
...... 5
5. TEST DISC .................................................................... 5
1. GENERAL
This Player Can Play the Following Discs and Files .... 1-1
Main Features ................................................................ 1-1
Getting Started .............................................................. 1-2
Basic Operations ........................................................... 1-4
W atching Movie Files .................................................... 1-7
Listening to Music Files ................................................. 1-8
Viewing Photo Files ....................................................... 1-9
Changing the Initial Settings .........................................1-10
Additional Information ................................................... 1-13
2. DISASSEMBLY AND REASSEMBLY
2-1. DISASSEMBLY.............................................................. 2-1
2-1-1. Disassembly Flow ......................................................... 2-1
2-1-2. Upper Case ................................................................... 2-1
2-1-3. Tray Cover Assy ............................................................ 2-2
2-1-4. BD Drive (Service Use) ................................................. 2-2
2-1-5. MAIN Board ................................................................... 2-3
2-1-6. AU-258 Board ................................................................ 2-3
2-1-7. Power Block ................................................................... 2-4
2-1-8. Circuit Boards Location ................................................. 2-4
2-2. REASSEMBLY ............................................................... 2-5
2-2-1. Upper Case ................................................................... 2-5
2-2-2. Tray Cover Assy ............................................................ 2-5
2-2-3. BD Drive (Service Use) ................................................. 2-6
2-2-4. MAIN Board ................................................................... 2-6
2-2-5. FL-176 Board/FR-271 Board ........................................ 2-7
2-2-6. DC FAN ........................................................................\
.. 2-7
3. BLOCK DIAGRAMS
3-1. Main Diagram ................................................................ 3-1
3-2. Audio Block Diagram..................................................... 3-3
3-3. FL/FR Block Diagram .................................................... 3-5
3-4. Power 1 Bloc k Diagram................................................. 3-7
3-5. Power 2 Bloc k Diagram................................................. 3-9
3-6. Power 3 Bloc k Diagram................................................. 3-11
3-7. Power 4 Bloc k Diagram................................................. 3-13
4. SCHEMATIC DIAGRAMS AND PRINTED WIRING
BOARDS
4-1. Frame Schematic Diag ram............................................ 4-1
4-2. Printed Wiring Boards and Schematic Diagr ams......... 4-5
A U-258 (ANALOG AUDIO) Schematic Diagram ...........4-5
A U-258 Printed Wiring Board ........................................4-7
FL-176 Printed Wiring Board ........................................4-11
FL-176 (FL/LED) Schematic Diag ram.......................... 4-13
FR-271 Printed Wiring Board ........................................4-15
FR-271 (SW/IR, INPUT/LED) Schematic Diagram ......4-17
5. TROUBLESHOOTING
Main Set, Power Supply Section................................... 5-1
Operation&Display Section ...........................................5-9
A udio Section ................................................................ 5-13
FL Section ..................................................................... 5-14
6. REPAIR PARTS LIST
6-1. Exploded Views ............................................................. 6-1
6-1-1. Case Assy ................................................................ 6-1
6-1-2. Main Chassis Block .................................................. 6-2
6-1-3. Main Block ................................................................ 6-3
6-2. Electrical Par ts List....................................................... 6-4
