Sony 3m5f 18 c 821 service manual

Page 1

SERVICE MANUAL

Ver 1.0 2002.08

3M5F-180821

(CDX-5F821N/5F821R)

AEP Model
UK Model

- CDX-5F821NVEFISION:-DB
- CDX-5F821RVERSION:-AB

TABLE OF CONTENTS

SERVICING NOTES .......................................................... 2

274.
275.
276.
277.
278.

2~l0.

9-374-104-01
2002H0500-1
© 2002.08

DISASSEMBLY
Disassembly Flow ...........................................................
Cover (Up), Chassis Assy .
Bracket (L), Bracket (R)
Chassis (T)
MD Board ..
Loading Motor Sub
Floating Block Assy
Chucking Arm Assy
Optical Pick7up (KSS7720A)

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DIAGRAMS

Block Diagram 7 SERVO Section 7..
Block Diagram 7 MAIN Section 7
Note for Primed Wiring Boards and
Schematic Diagrams ....................................................... 11
Printed Wiring Boards

7 MD (Component Side)/LED/SW Boards 7 ................. 12
Printed Wiring,y Boards

7 MD Board (Conductor Side) 7 ...........
Schematic Diagram 7 MD Board (1/4)
Schematic Diagram 7 MD Board (2/4) 15
Schematic Diagram 7 MD Board (3/4) 7 . l6
Schematic Diagram 7 MD (4/4)/LED/SW Board» 7 17
IC Pin Function Description ........................................ 21

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l4

Sony Corporation
e Vehicle Company

Published by Sony Engineering Corporation

EXPLODED VIEWS
Cover Section
Chassis Section
Floating Block Section

23
24
25

ELECTRICAL PARTS LIST ............................... 26

COMPACT DISC MECHANISM
S 0 NY;

Page 2

3M5F-18C821

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT

The laser diode in the optical pick~up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.

The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pickeup block. Therefore, when checking the laser diode emis
sion, observe from more than 30 cm away from the objective lens.

CAUTIONiINVISIELE LASER RADIATION WHEN OPEN
DO NOT STARE INTO BEAM 0R

VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
-

This label is located on the drive units internal
chassis.

When replacing the main chass 'sy of mechanism deck which
have the CAUTION LABEL attached, please be sure to put a
new CAUTION LABEL (3-2237913-1 l) to the main chassis assy.

SAFETY-RELATED COMPONENT WARNING I!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL T0 SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

Notes on chip component replacement

O Never reuse a disconnected chip component.

O Notice that the minus side of a tantalum capacitor may be damA
aged by heat.

Flexible Circuit Board Repairing

O Keep the temperature of the soldering iron around 270 C durA
ing repairing.

O Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

O Be careful not to apply force on the conductor when soldering
or unsoldering.

TEST DISC

This set can playback a CD-R CDARW for audio use. When test
this et, use the following test disc.

Test disc for CDAR: TCD-ROSZLMT (Part No.: 1725020634)
Test disc for CDARW: TCD-WOSZL (Part No.: 12502-063-2)