Free Audio Service Manuals - Free download Fisher 601 Service Manual

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CONTENTS and SERVICE TIPS

REQUIRED TEST EQUIPMENT
MECHANICAL DISASSEMBLY
DIAL STRINGING

HARMONIC DISTORTION TEST
CHASSIS LAYOUT (601)
SIGNAL FLOW (601)

CHASSIS LAYOUT I747)
SIGNAL FLOW I747)

TUNER

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MULTIPLEX 10
TUNER ALIGNMENT 12
PREAMP, AUDIO INPUT 14
CONTROL AMP, VOLUME 16
DECODER 18
POWER AMP, PREDRIVER 20
POWER SUPPLY 22
PARTS LIST 24

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CAUTIONl This precision high-fidelity instrument should be serviced only by qualified personnel,
- trained in the repair of transistor equipment and printed circuitry.

Many of these items are included only as a reminder - they
are normal procedures for experienced technicians. Shortcuts
may be taken, but these often cause additional damage to
transistors, circuit components, or primed circuit boards.

SOLDERING: A well-tinned, hot, clean soldering iron tip
will make soldering easier, without causing damage to the
printed circuit board or the components mounted on it.
Regular use of a sponge cleaner will maintain a clean
soldering surface. The heat available at the tip. (not the watt-
age of the iron) is important, Some 50»watt irons reach tem-
peratures of 1,000° F, while others will hardly melt solder.
Smalldiameter tips should be used for single solder con-
nections, pyramid and chisel tips for large areas.

Always disconnect the AC power cord from the line when
soldering. Turning the power switch OFF is not sufficient.
Power-line leakage paths through the heating element of the
iron may destroy transistors.

PARTS REMOVAL: if a part is not being returned for in-
warranty factory replacement, it may be cut in half (with
diagonal cutting pliers) to make removal easier. Multiple
terminal parts, sum as IF transformers or electrolytic capaci-
tors, should be removed using special de-soldering tips made
especially for this purpose. Removing solder from terminals
reduces the possibility of breaking the printed circuit board
when the part is removed.

ACCIDENTAL SHORTS: A clean working area, free of
metal particles, screws, etc., is an important preventive in
avoiding servicing problems. Screws removed from the chassis
during servicing should be stored in a box until needed. While
a set is operating, it takes only an instant for a base-to-col-
lector short to destroy a transistor (and others direct-coupled
to it). In the time it takes for a dropped screw, washer, or
screwdriver to contact a pair of terminals (or terminal and
chassis), a transistor can be ruined.

SOLID-STATE DEVICES: Integrated Circuits contain the
equivalent of many circuit parts, including transistors, diodes.
resistors, and capacitors. The preferred troubleshooting pro-
cedure requires isolating the trouble to one stage using AC
signal tracing methods. Once the suspected stage is located,
the DC voltages at the input and output leads are measured to
give an accurate indication of the operating conditions of the
IC. DO NOT use an ohmmeter to check continuity with the
IC mounted on the printed circuit board. Forward biasing the
internal junctions within the lC may burn out the transistors.
Do not replace a defective lC until all external resistors,
wpacitors, and transformers are checked first, to prevent the
replacement K: from failing immediately due to a defect in
the connecting components. Solder and unsolder each lead
separately using a pliers or other heat sink on the lead to
prevent damage from excessive heat. Check that the leads are

connected to the correct locations on the printed circuit
board before turning the set on.

Whenever possible, a transistor tester should be used to de-
termine the condition of a transistor or diode. Ohmmeter
checks do not provide conclusive data, and many even destroy
the iunctionls) within the device.

Never attempt to repair a transistor power amplifier module
until the power supply filter-capacitors are fully discharged.

if an output or driver transistor becomes defective (opens or
shorts) always check ALL direct diodes in that channel. In addition, check the bias pot and
other parts in the bias network before installing replacement
transistors. All output and driver transistors in one channel
may be destroyed if the bias network is defective. After parts
replacement, check bias for specified idling current.

In someapplications,replacement of transistors must be made
fromthe same beta group as the original type. The beta group
is indicated by a colored marking on the transistor. lnclude
this information when ordering replacements.

When mounting a replacement power transistor, be sure the
bottom of the flange, mica insulator, and the surface of the
heat sink, are free of foreign matter. Dust and grit will pre-
vent flat contact, reducing heat transfer to the heat sink.
Metallic particles can puncture the insulator, cause a short,
and destroy the transistor.

Silicone grease must be used between the transistor and the
mica insulator and between the mica and the heat sink for
best heat transfer. Use Dow-Corning D03 or an equivalent
compound made for power transistor heat conduction.

Use care when making connections to speakers and output
terminals. To reduce the possibility of shorts, lugs should be
used on the exposed ends, or stranded wire should be tinned
to prevent frayed wire ends. Current in the speakers and out-
put circuitry is quite high 4 poor contacts, or small wire,
can cause significant power losses. For wire lengths greater
than 30 feet, 16 AWG, or heavier, should be used.

VOLTAGE MEASUREMENTS: All voltages are measured
with the line voltage adjusted to 120 volts. All measured
voltages are 1 20%. DC voltages are measured to chassis with
a VTVM, with no signal input unless otherwise noted. AC sig-
nal voltages are measured under the conditions specified on
the schematic.

ALIGNMENT PROCEDURES: DO NOT attempt realign-
ment unless the required test equipment is available, and the
alignment procedure is thoroughly understood.

PRINTED IN U.S.A.

Fisher 601 Service Manual

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