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CONTENTS1. SAFETY PRECAUTIONS 1
2. PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY
SENSITIVE(ES)DEVICES
1
4. PREVERTION OF STATIC ELECTRICITY DISCHARGE
3
5. ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT
4
5.1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST 4
5.2 BRACKET EXPLOSED VIEW AND PART LIST
6
6. ELECTRICAL CONFIRMATION
8
6.1 VIDEO OUTPUT (LUMINANCE SIGNAL) CONFIRMATION
8
6.2 VIDEO OUTPUT(CHROMINANCE SIGNAL) CONFIRMATION
9
7. MPEG BOARD CHECK WAVEFORM
10
8. IC BLOCK DIAGR A
M & DESCRIPTION 11
9. SCHEMATIC & PCB WIRING DIAGRAM 41
10. SPARE PARTS LIST
53
8.1 MT1336
11
8.2 M
T1379 19
8.3 U 2
14 HY29F800 35
8.4 HY57V641620HG 38
3. CONTROL BUTTON LOCATIONS AND EXPLANATIONS
2
5.3 MISCELL A
NEOUS 7
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1.1 GENERAL GUIDELINES
1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have
been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers
shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from b\
eing exposed
to shock hazards.
Some semiconductor(solid state)devices can be damaged easily by static\
electricity. Such components
commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused b\
y electro static discharge(ESD).
1. Immediately before handling any semiconductor component or semiconductor\
-equipped assembly, drain
off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,place the\
assembly on a conductive
surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.\
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES \
devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until \
immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically short\
ed together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a \
replacement ES device, touch
the protective material to the chassis or circuit assembly into which th\
e device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices.\
(Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of y\
our foot from a carpeted floor can
generate static electricity(ESD).
notice (1885x323x2 tiff)
